Nonvolatile memory device and operation method thereof

ABSTRACT

A nonvolatile memory device includes a nonvolatile memory, a volatile memory being a cache memory of the nonvolatile memory, and a first controller configured to control the nonvolatile memory. The nonvolatile memory device further includes a second controller configured to receive a device write command and an address, and transmit, to the volatile memory through a first bus, a first read command and the address and a first write command and the address sequentially, and transmit a second write command and the address to the first controller through a second bus, in response to the reception of the device write command and the address.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority from Korean Patent Application Nos.10-2015-0170123, filed Dec. 1, 2015, 10-2015-0170119, filed Dec. 1,2015, 10-2015-0170115, filed Dec. 1, 2015, 10-2015-0171665, filed Dec.3, 2015, and 10-2015-0171660, filed Dec. 3, 2015, in the KoreanIntellectual Property Office, the disclosures of which are incorporatedherein by reference in their entireties.

BACKGROUND

1. Field

Apparatuses and methods consistent with example embodiments relate to asemiconductor memory, and more particularly, relates to a nonvolatilememory device and an operation method thereof.

2. Description of Related Art

A semiconductor memory refers to a memory device that is implementedusing semiconductor such as silicon (Si), germanium (Ge), galliumarsenide (GaAs), indium phosphide (InP), or the like. A semiconductormemory device is roughly divided into a volatile memory device and anonvolatile memory device.

A volatile memory device refers to a memory device that loses datastored therein at power-off. The volatile memory device includes astatic random access memory (SRAM), a dynamic ram (DRAM), a synchronousDRAM or the like. A nonvolatile memory device refers to a memory devicethat retains data stored therein even at power-off. The nonvolatilememory device includes a read only memory (ROM), a programmable ROM(PROM), an electrically programmable ROM (EPROM), an electricallyerasable and programmable ROM (EEPROM), a flash memory device, aphase-change RAM (PRAM), a magnetic RAM (MRAM), a resistive RAM (RRAM),a ferroelectric RAM (FRAM), or the like.

Because a response speed and an operation speed of the DRAM are fast,the DRAM is widely used as a main memory of a system. However, becausethe DRAM is a volatile memory in which data is lost when a power is shutoff, a separate device is used to retain data stored in the DRAM. Inaddition, because the DRAM stores data using capacitors, the size of aunit cell is large, thereby making it difficult to increase a DRAMcapacity within a restricted area.

SUMMARY

According to example embodiments, a nonvolatile memory device includes anonvolatile memory, a volatile memory being a cache memory of thenonvolatile memory, and a first controller configured to control thenonvolatile memory. The nonvolatile memory device further includes asecond controller configured to receive a device write command and anaddress, and transmit, to the volatile memory through a first bus, afirst read command and the address and a first write command and theaddress sequentially, and transmit a second write command and theaddress to the first controller through a second bus, in response to thereception of the device write command and the address.

According to example embodiments, a nonvolatile memory device includes anonvolatile memory, a volatile memory being a cache memory of thenonvolatile memory, and a first controller configured to control thenonvolatile memory. The nonvolatile memory device further includes asecond controller configured to receive a first device read command andan address, and transmit a first read command and the address to thevolatile memory through a first bus, and transmit a second read commandand the address to the first controller through a second bus, inresponse to the reception of the device read command and the address.

According to example embodiments, a nonvolatile memory device includes anonvolatile memory, a volatile memory being a cache memory of thenonvolatile memory, and a first controller configured to share a memorydata line with the volatile memory, and control the nonvolatile memory.The nonvolatile memory device further includes a second controllerconfigured to share a tag data line with the volatile memory and thefirst controller, receive a first device read command and an addressfrom an external device, and transmit a first read command and theaddress to the volatile memory through a first bus, and transmit asecond read command and the address to the first controller through asecond bus, in response to the reception of the device read command andthe address. The volatile memory is configured to, in response to thetransmission of the first read command and the address, transmit,through the memory data line, first data that is stored in a first areacorresponding to a part of the address, of the volatile memory, andtransmit, through the tag data line, a tag that is stored in the firstarea. The second controller is further configured to receive thetransmitted tag from the volatile memory through the tag data line,determine whether a cache hit occurs, based on the received tag and theaddress, and transmit, to the external device, a result of thedetermination.

According to example embodiments, there is provided an operation methodof a nonvolatile memory device including a nonvolatile memory, avolatile memory being a cache memory of the nonvolatile memory, a firstcontroller configured to share a memory data line with the volatilememory, and control the nonvolatile memory, and a second controllerconfigured to control the volatile memory through a first bus, andcontrol the first controller through a second bus, in response to acontrol of an external device. The method includes receiving, by thesecond controller, a device write command and an address from theexternal device, and controlling, by the second controller, the volatilememory and the nonvolatile memory in response to the receiving of thedevice write command and the address such that first data that is storedin a first area corresponding to a part of the address, of the volatilememory, is selectively stored into the nonvolatile memory based on afirst tag that is stored in the first area. The method further includesreceiving, by the volatile memory and the first controller, write datafrom the external device through the memory data line, and controlling,by the second controller, the volatile memory and the first controllersuch that the received write data is stored in the first area of thevolatile memory and/or in a second area corresponding to the address, ofthe nonvolatile memory.

According to example embodiments, there is provided an operation methodof a nonvolatile memory device including a nonvolatile memory, avolatile memory being a cache memory of the nonvolatile memory, a firstcontroller configured to share a memory data line with the volatilememory, and control the nonvolatile memory, and a second controllerconfigured to control the volatile memory through a first bus, andcontrol the first controller through a second bus, in response to acontrol of an external device. The method includes receiving, by thesecond controller, a first device read command and an address from theexternal device, and in response to the receiving of the first deviceread command and the address, controlling, by the second controller, thevolatile memory to transmit first data that is stored in a first areacorresponding to a part of the address, of the volatile memory, to theexternal device through the memory data line, and transmit a tag that isstored in the first area through a tag data line. The method furtherincludes determining, by the second controller, whether a cache hitoccurs, based on the transmitted tag and the address, and transmitting,to the external device, a result of the determining.

According to example embodiments, a memory system includes a firstmemory, a second memory being a cache memory of the first memory, and amemory controller configured to share a data bus with the first memoryand the second memory, exchange data with the first memory and thesecond memory through the data bus, and during a read operation, receivecache information from the second memory, and selectively receive datafrom the first memory based on the received cache information.

According to example embodiments, a memory system includes a firstmemory, a second memory being a cache memory of the first memory, and amemory controller configured to share a data bus with the first memoryand the second memory, exchange data with the first memory and thesecond memory through the data bus, and during a write operation,receive cache information from the second memory, and selectively storedata from the second memory into the first memory based on the receivedcache information.

According to example embodiments, a nonvolatile memory device includes anonvolatile memory, a volatile memory being a cache memory of thenonvolatile memory, and a first controller configured to control thenonvolatile memory. The nonvolatile memory device further includes asecond controller configured to receive a device write command and anaddress from an external device, and in response to the reception of thedevice write command and the address, control the volatile memory totransmit, to the first controller, first data and a first tag that arestored in a first area corresponding to the address, of the volatilememory, and control the first controller to store the transmitted firstdata in the nonvolatile memory based on the address and the transmittedfirst tag.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram illustrating a user system according toexample embodiments of the inventive concept.

FIG. 2 is a block diagram illustrating the nonvolatile memory module ofFIG. 1.

FIG. 3 is a flowchart illustrating a write operation of the nonvolatilememory module of FIG. 2.

FIG. 4 is a timing diagram for describing, in detail, the operationmethod of FIG. 3.

FIG. 5 is a flowchart illustrating a read operation of the nonvolatilememory module 100 of FIG. 2.

FIG. 6 is a timing diagram for describing, in detail, an operation ofFIG. 5.

FIG. 7 is a flowchart illustrating another write operation of thenonvolatile memory module of FIG. 2.

FIG. 8 is a timing diagram for describing, in detail, the read operationof FIG. 7.

FIG. 9 is a drawing for describing a cache structure of the volatilememory of FIG. 2.

FIGS. 10 and 11 are block diagrams for describing, in detail, a writeoperation of FIG. 3.

FIGS. 12 and 13 are block diagrams for describing, in detail, a readoperation of FIGS. 5 and 7.

FIG. 14 is a flowchart illustrating a read operation of the nonvolatilememory module of FIG. 2, according to example embodiments of theinventive concept.

FIG. 15 is a block diagram illustrating the nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.

FIG. 16 is a flowchart illustrating a read operation of the nonvolatilememory module of FIG. 15.

FIG. 17 is a timing diagram for describing a read operation of FIG. 16.

FIG. 18 is a flowchart illustrating a read operation of the nonvolatilememory module of FIG. 15, according to example embodiments of theinventive concept.

FIG. 19 is a diagram for describing a transaction identificationassigning operation according to a read operation of FIG. 18.

FIG. 20 is a timing diagram for describing, in detail, the readoperation of FIG. 18.

FIG. 21 is a drawing illustrating, in detail, a tag according to exampleembodiments of the inventive concept.

FIG. 22 is a block diagram illustrating a nonvolatile memory included inthe nonvolatile memory module according to the inventive concept.

FIG. 23 is a circuit diagram illustrating a first memory block of thememory blocks included in the nonvolatile memory of the nonvolatilememory module according to example embodiments of the inventive concept.

FIG. 24 is a block diagram illustrating a volatile memory of thenonvolatile memory module according to example embodiments of theinventive concept.

FIG. 25 is a drawing illustrating a server system to which thenonvolatile memory system according to example embodiments of theinventive concept is applied.

FIG. 26 is a block diagram illustrating a user system to which thenonvolatile memory module according to example embodiments of theinventive concept is applied.

FIG. 27 is a block diagram illustrating a nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.

FIG. 28 is a block diagram illustrating a nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.

FIG. 29 is a block diagram illustrating the nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.

FIG. 30 is a block diagram illustrating a nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.

FIG. 31 is a block diagram illustrating a nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.

FIG. 32 is a block diagram illustrating the nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.

FIG. 33 is a block diagram illustrating a nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.

FIG. 34 is a block diagram illustrating the nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.

FIG. 35 is a block diagram illustrating the nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.

FIG. 36 is a drawing for describing, in detail, a tag of FIG. 9.

FIG. 37 is a drawing for describing a tag managing method of thenonvolatile memory module of FIG. 2.

FIG. 38 is a drawing for describing a tag managing method of thenonvolatile memory module of FIG. 2.

FIG. 39 is a timing diagram for describing a tag sending method of thenonvolatile memory modules of FIGS. 37 and 38.

FIG. 40 is a block diagram illustrating a nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.

FIG. 41 is a block diagram illustrating a nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.

FIG. 42 is a block diagram illustrating the nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.

FIG. 43 is a flowchart illustrating an operation method of thenonvolatile memory module of FIG. 2.

FIG. 44 is a flowchart illustrating an operation method of thenonvolatile memory module of FIG. 2, according to example embodiments ofthe inventive concept.

FIG. 45 is a block diagram illustrating the nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.

FIG. 46 is a block diagram illustrating a nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.

FIG. 47 is a flowchart illustrating an operation of the NVM controllerof the nonvolatile memory module of FIG. 2.

FIG. 48 is a block diagram for describing, in detail, an operationmethod illustrated in FIG. 47.

FIG. 49 is a timing diagram for describing, in detail, the operationmethod of FIGS. 47 and 48.

FIG. 50 is a flowchart illustrating an operation of the NVM controllerof FIG. 48, according to example embodiments of the inventive concept.

FIG. 51 is a flowchart illustrating an operation of the nonvolatilememory module of FIG. 2, according to example embodiments of theinventive concept.

FIG. 52 is a block diagram for describing, in detail, an operation ofFIG. 51.

FIG. 53 is a block diagram illustrating a nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.

FIG. 54 is a drawing for describing an operation of the cache manager ofFIG. 53.

FIG. 55 is a timing diagram for describing an operation of thenonvolatile memory module of FIG. 53.

FIG. 56 is a flowchart illustrating an operation of the nonvolatilememory module of FIG. 2, according to example embodiments of theinventive concept.

FIG. 57 is a timing diagram for describing, in detail, the operation ofFIG. 56.

FIG. 58 is a flowchart illustrating an operation of the nonvolatilememory module of FIG. 2.

FIG. 59 is a block diagram for describing, in detail, the operationmethod illustrated in FIG. 58.

FIG. 60 is a flowchart for describing, in detail, the operation methodillustrated in FIG. 58.

FIGS. 61 and 62 are drawings for describing the operation of thevolatile memory of FIG. 59 in detail.

FIG. 63 is a block diagram illustrating the nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.

FIG. 64 is a flowchart illustrating an operation of the nonvolatilememory module of FIG. 63.

FIG. 65 is a timing diagram for describing, in detail, the operationaccording to the flowchart of FIG. 64.

FIG. 66 is a block diagram for describing, in detail, the operationaccording to the timing diagram of FIG. 65.

FIG. 67 is a timing diagram for describing, in detail, the operationaccording to the flowchart of FIG. 64, according to example embodimentsof the inventive concept.

FIG. 68 is a block diagram illustrating the nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.

FIG. 69 is a block diagram for describing a method of implementing afirst flush channel of the first volatile memory chip illustrated inFIG. 68.

FIG. 70 is a block diagram illustrating another user system to which thenonvolatile memory module according to example embodiments of theinventive concept is applied.

DETAILED DESCRIPTION

FIG. 1 is a block diagram illustrating a user system according toexample embodiments of the inventive concept. Referring to FIG. 1, auser system 10 may include nonvolatile memory modules 100 or nonvolatilememory devices, a processor 101, a chipset 102, a graphic processingunit (GPU) 103, an input/output device (I/O) 104, and a storage device105. In example embodiments, the user system 10 may be a computingsystem such as a computer, a notebook, a server, a workstation, aportable communication terminal, a personal digital assistant (PDA), aportable multimedia player (PMP), a smartphone, or a wearable device.

The processor 101 may control an overall operation of the user system10. The processor 101 may perform various operations of the user system10 and may process data.

The nonvolatile memory modules 100 may be directly connected to theprocessor 101. For example, each of the nonvolatile memory modules 100may have a form of a dual in-line memory module (DIMM) and may beinstalled in a DIMM socket directly connected to the processor 101 tocommunicate with the processor 101. In example embodiments, each of thenonvolatile memory module 100 may communicate with the processor 101based on a NVDIMM protocol.

Each of the nonvolatile memory modules 100 may be used as a main memoryor a working memory. Each of the nonvolatile memory modules 100 mayinclude a nonvolatile memory and a volatile memory. The nonvolatilememory includes a memory, which does not lose data stored therein evenat power-off, such as a read only memory (ROM), a programmable ROM(PROM), an electrically programmable ROM (EPROM), an electricallyerasable and programmable ROM (EEPROM), a flash memory, a phase-changeRAM (PRAM), a magnetic RAM (MRAM), a resistive RAM (RRAM), or aferroelectric RAM (FRAM). The volatile memory may include a memory,which loses data stored therein at power-off, such as a static RAM(SRAM), a dynamic RAM (DRAM), or a synchronous DRAM (SDRAM).

In example embodiments, the nonvolatile memory of each nonvolatilememory module 100 may be used as a main memory of the user system 10 orthe processor 101, and the volatile memory thereof may be used as acache memory of the user system 10, the processor 101, or acorresponding nonvolatile memory module 100.

The chipset 102 may be electrically connected to the processor 101 andmay control hardware of the user system 10 under control of theprocessor 101. For example, the chipset 102 may be connected to the GPU103, the input/output device 104, and the storage device 105 throughmain buses respectively and may perform a bridge operation about themain buses.

The GPU 103 may perform a series of arithmetic operations for outputtingimage data of the user system 10. In example embodiments, the GPU 103may be embedded in the processor 101 in the form of a system-on-chip(SoC).

The input/output device 104 may include various devices that make itpossible to input data or an instruction to the user system 10 or tooutput data to an external device. For example, the input/output device104 may include user input devices such as a keyboard, a keypad, abutton, a touch panel, a touch screen, a touch pad, a touch ball, acamera, a microphone, a gyroscope sensor, a vibration sensor, apiezoelectric element, a temperature sensor, and a biometric sensor anduser output devices such as a liquid crystal display (LCD), an organiclight emitting diode (OLED) display device, an active matrix OLED(AMOLED) display device, a light emitting diode (LED), a speaker, and amotor.

The storage device 105 may be used as a mass storage medium of the usersystem 10. The storage device 105 may include mass storage media such asa hard disk drive (HDD), a solid state drive (SSD), a memory card, and amemory stick.

FIG. 2 is a block diagram illustrating the nonvolatile memory module ofFIG. 1. Referring to FIG. 2, the nonvolatile memory module 100 mayinclude a module controller 110, a heterogeneous memory device 120, adata buffer (DB) 130, and a serial presence detect chip (SPD) 140.

The module controller 110 may receive a command/address CA from theprocessor 101 and may control the heterogeneous memory device 120 inresponse to the received command/address CA. In example embodiments, themodule controller 110 may provide the heterogeneous memory device 120with a command/address CA_n and a command/address CA_v in response tothe command/address CA from the processor 101.

In example embodiments, the command/address CA_n may be acommand/address for controlling a nonvolatile memory 123 included in theheterogeneous memory device 120, and the command/address CA_v may be acommand/address for controlling a volatile memory 121 included in theheterogeneous memory device 120.

Below, for descriptive convenience, the command/address CA from theprocessor 101 may be referred to as “module command/address”, thecommand/address CA_v provided from the module controller 110 to thevolatile memory 121 may be referred to as “volatile memory (VM)command/address”, and the command/address CA_n provided from the modulecontroller 110 to a nonvolatile memory (NVM) controller 122 may bereferred to as “NVM command/address”.

In example embodiments, the NVM command/address CA_n and the VMcommand/address CA_V may be provided through different command/addressbuses.

In example embodiments, the module controller 110 may be a registerclock driver (RCD).

The heterogeneous memory device 120 may include the volatile memory 121,the NVM controller 122, and the nonvolatile memory 123. The volatilememory 121 may operate in response to the VM command/address CA_v fromthe module controller 110. The volatile memory 121 may output data and atag TAG through a memory data line MDQ and a tag data line TDQrespectively in response to the VM command/address CA_v. The volatilememory 121 may write data and a tag respectively received through thememory data line MDQ and the tag data line TDQ based on the VMcommand/address CA_v.

The NVM controller 122 may operate in response to the NVMcommand/address CA_n from the module controller 110. For example, on thebasis of the NVM command/address CA_n from the module controller 110,the NVM controller 122 may program data received through the memory dataline MDQ in the nonvolatile memory 123 or may output data programmed inthe nonvolatile memory 123 through the memory data line MDQ.

The NVM controller 122 may perform various operations for controllingthe nonvolatile memory 123. For example, the NVM controller 122 mayperform operations such as garbage collection, wear leveling, andaddress conversion, to use the nonvolatile memory 123 effectively. Inexample embodiments, the NVM controller 122 may further include elementssuch as an error correction circuit and a randomizer.

In example embodiments, the volatile memory 121 and the NVM controller122 may share the same memory data line MDQ.

In example embodiments, the volatile memory 121 and the modulecontroller 110 may share the tag data line TDQ. Alternatively, thevolatile memory 121, the NVM controller 122, and the module controller110 may share the tag data line TDQ. The NVM controller 122 may output atag TAG through the tag data line TDQ.

The data buffer 130 may receive data through the memory data line MDQand may provide the received data to the processor 101 through a dataline DQ. Alternatively, the data buffer 130 may receive data through thedata line DQ and may output the received data through the memory dataline MDQ. In example embodiments, the data buffer 130 may operate underthe control of the module controller 110 (e.g., a buffer command). Inexample embodiments, the data buffer 130 may distinguish a signal on thememory data line MDQ and a signal on the data line DQ. Alternatively,the data buffer 130 may block a signal between the memory data line MDQand the data line DQ. That is, a signal of the memory data line MDQ maynot affect the data line DQ by the data buffer 130, or a signal of thedata line DQ may not affect the memory data line MDQ by the data buffer130.

In example embodiments, the memory data line MDQ may be a datatransmission path among elements included in the nonvolatile memory(e.g., a volatile memory, a nonvolatile memory, a data buffer, etc.),and the data line DQ may be a data transmission path between thenonvolatile memory module 100 and the processor 101. The tag data lineTDQ may be a transmission path for sending and receiving a tag TAG.

In example embodiments, each of the memory data line MDQ, the data lineDQ, and the tag data line TDQ may include a plurality of wires.Furthermore, each of the memory data line MDQ, the data line DQ, and thetag data line TDQ may include a memory data strobe line MDQS, a datastrobe line DQS, and a tag data strobe line TDQS. Below, for ease ofillustration, reference numerals and configurations of the memory datastrobe line MDQS, the data strobe line DQS, and the tag data strobe lineTDQS are omitted. However, example embodiments of the inventive conceptmay not be limited thereto. For example, elements connected with thememory data strobe line MDQS, the data strobe line DQS, and the tag datastrobe line TDQS may send and receive data or tags in synchronizationwith signals of the memory data strobe line MDQS, the data strobe lineDQS, and the tag data strobe line TDQS.

The SPD 140 may be a programmable read only memory device (e.g., anelectrically erasable programmable read-only memory (EEPROM)). The SPD140 may include initial information or device information DI of thenonvolatile memory module 100. In example embodiments, the SPD 140 mayinclude the device information DI such as a module form, a moduleconfiguration, a storage capacity, a module type, an executionenvironment, and the like that are associated with the nonvolatilememory module 100. When the user system 10 including the nonvolatilememory module 100 is booted, the processor 101 may read the deviceinformation DI from the SPD 140 and may recognize the nonvolatile memorymodule 100 based on the device information DI. The processor 101 maycontrol the nonvolatile memory module 100 based on the deviceinformation DI read from the SPD 140.

Below, for descriptive convenience, it may be assumed that the volatilememory 121 is a DRAM and that the nonvolatile memory 123 is a NAND flashmemory. However, example embodiments of the inventive concept may not belimited thereto. For example, the volatile memory 121 may includeanother kind of random access memory, and the nonvolatile memory 123 mayanother kind of nonvolatile memory device.

In example embodiments, the volatile memory 121 may include a pluralityof volatile memory chips, each of which is implemented with a separatechip, a separate package, etc. The volatile memory chips may beconnected with the module controller 110 or the NVM controller 122through different memory data lines or tag data lines.

In example embodiments, the processor 101 may use the nonvolatile memory123 of the nonvolatile memory module 100 as a main memory. That is, theprocessor 101 may recognize a storage space of the nonvolatile memory123 as a main memory area. The volatile memory 121 may operate as acache memory of the processor 101 and the nonvolatile memory 123. Inexample embodiments, the volatile memory 121 may be used as a write-backcache. That is, the module controller 110 may determine a cache hit or acache miss in response to the module command/address CA from theprocessor 101 and may control the volatile memory 121 or the nonvolatilememory 123 based on the determination result,

In example embodiments, the cache hit may indicate the case that datacorresponding to the module command/address CA received from theprocessor 101 is stored in the volatile memory 121. The cache miss mayindicate the case that no data corresponding to the modulecommand/address CA received from the processor 101 is stored in thevolatile memory 121.

In example embodiments, the module controller 110 may determine whetherthe cache hit or the cache miss occurs, based on the tag TAG. The modulecontroller 110 may determine whether the cache hit or the cache missoccurs, based on a result of comparing the module command/address CAfrom the processor 101 and the tag TAG.

In example embodiments, the tag TAG may include a part of an addressthat corresponds to data stored in the volatile memory 121. In exampleembodiments, the module controller 110 may exchange the tag TAG with thevolatile memory 121 through the tag data line TDQ. In exampleembodiments, when data is written in the volatile memory 121, the tagTAG corresponding to the data may be written together with the dataunder the control of the module controller 110.

In example embodiments, the volatile memory 121 and the nonvolatilememory 123 may have a direct mapping relation of n:1 (“n” being anatural number). That is, the volatile memory 121 may be a direct mappedcache of the nonvolatile memory 123. For example, a first volatilestorage area of the volatile memory 121 may correspond to 1st to nthnonvolatile storage areas of the nonvolatile memory 123. In this case,the size of the first volatile storage area may be the same as that ofeach of the nonvolatile storage areas. In example embodiments, the firstvolatile storage area may further include an area for storing additionalinformation (e.g., a tag, an ECC, dirty information, etc.).

The nonvolatile memory module 100 may further include a separate memory.The separate memory may store information, which is used in the NVMcontroller 122, such as data, a program, and software. For example, theseparate memory may store information, which is managed by the NVMcontroller 122, such as a mapping table and a flash translation layer(FTL). Alternatively, the separate memory may be a buffer memory thattemporarily stores data read from the nonvolatile memory 123 or data tobe stored in the nonvolatile memory 123.

Below, a write operation and a read operation of the nonvolatile memorymodule 100 will be described with reference to FIGS. 3 to 8. Below, fordescriptive convenience, “_v” may be attached to elements (e.g., data, atag, a command/address, etc.) associated with the volatile memory 121.For example, a VM command/address that is output from the modulecontroller 110 to control the volatile memory 121 may be expressed by“CA_v”, and data that is output from the volatile memory 121 under thecontrol of the module controller 110 may be expressed by “DT_v”. In moredetail, a VM write command for writing data in the volatile memory 121may be expressed by “WR_v”, and a VM read command for reading data fromthe volatile memory 121 may be expressed by “RD_v”.

Likewise, “_n” may be attached to elements (e.g., data, a tag, acommand/address, etc.) associated with the nonvolatile memory 123. Forexample, an NVM command/address that is output from the modulecontroller 110 to control the nonvolatile memory 123 may be expressed by“CA_n”, and data that is output from the nonvolatile memory 123 underthe control of the module controller 110 or the NVM controller 122 maybe expressed by “DT_n”. In more detail, an NVM write command for writingdata in the nonvolatile memory 123 may be expressed by “WR_n”, and anNVM read command for reading data from the nonvolatile memory 123 may beexpressed by “RD_n”.

FIG. 3 is a flowchart illustrating a write operation of the nonvolatilememory module of FIG. 2. Referring to FIGS. 1 to 3, in step S11, theprocessor 101 may send a module write command and address (WR/ADD). Forexample, to write data DT_w in the nonvolatile memory module 100, theprocessor 101 may send the module write command WR and the address ADDto the nonvolatile memory module 100. In example embodiments, a modulewrite command and address (WR/ADD) may include an address ADD thatcorresponds to the write data DT_w. The address ADD corresponding to thewrite data DT_w may be a logical address (or a memory address)corresponding to a storage space of the nonvolatile memory module 100,that is, a part of a storage space of the nonvolatile memory 123.

In step S12, the nonvolatile memory module 100 may perform a readoperation about the volatile memory 121 in response to the receivedmodule write command and address (WR/ADD). For example, the nonvolatilememory module 100 may read data and a tag TAG from an area, whichcorresponds to the received address ADD or to a part of the receivedaddress ADD, among an area of the volatile memory 121. In exampleembodiments, the nonvolatile memory module 100 may compare the read tagTAG and the address ADD and may determine whether a cache hit or a cachemiss occurs, based on the comparison result.

In step S13, the nonvolatile memory module 100 may selectively perform aflush operation based on the result of the read operation performed instep S12. For example, when the result of the read operation indicatesthe cache miss, the nonvolatile memory module 100 may perform a flushoperation such that data read from the volatile memory 121 is stored inthe nonvolatile memory 123. In example embodiments, as described withreference to FIG. 2, the NVM controller 122, which controls thenonvolatile memory 123, and the volatile memory 121 may share the memorydata line MDQ. That is, when the memory data line MDQ is driven with avoltage by data read from the volatile memory 121, the NVM controllerthat controls the nonvolatile memory 123 may receive (or detect) dataread from the volatile memory 121 through the memory data line MDQ. TheNVM controller 122 may program the received data in the nonvolatilememory 123.

In example embodiments, when the result of the read operation indicatesthe cache hit, the nonvolatile memory module 100 may not perform theflush operation. Alternatively, when the result of the read operationindicates the cache hit and when the read data is dirty data, thenonvolatile memory module 100 may perform the flush operation.

In example embodiments, operations of the nonvolatile memory module 100such as the flush operation, determination of the cache hit or cachemiss, and determination of dirty data may be performed by the NVMcontroller 122.

In step S14, the processor 101 may send the write data DT_w to thenonvolatile memory module 100. In example embodiments, an operation ofstep S10 may be performed after a time elapses from step S11. That is,the processor 101 may send the module write command and address (WR/ADD)to the nonvolatile memory module 100 and may send the write data DT_w tothe nonvolatile memory module 100 after the time elapses. In this case,the time may be a write latency WL. In example embodiments, the writelatency WL may be a time or a clock period that is determined accordingto the operating characteristic of the nonvolatile memory module 100.Information about the write latency WL may be stored in the SPD 140 andmay be provided as the device information DI to the processor 101. Theprocessor 101 may send the write data DT_w based on the deviceinformation DI.

In step S15, the nonvolatile memory module 100 may write or program thereceived write data DT_w in the volatile memory 121 or the nonvolatilememory 123.

FIG. 4 is a timing diagram for describing, in detail, the operationmethod of FIG. 3. In example embodiments, sizes and timings aboutcommands/ADDresses, data, tags, etc. may not be limited to a timingdiagram illustrated in FIG. 4.

Referring to FIGS. 1 to 4, the nonvolatile memory module 100 may receivea module write command and first address (WR/ADD1) from the processor101. The nonvolatile memory module 100 may output the NVMcommand/address CA_n and the VM command/address CA_n in response to thereceived module write command and first address (WR/ADD1). In this case,the NVM command/address CA_n may include an NVM write command and firstaddress (WR_v/ADD1), and the VM command/address CA_v may include a VMread command and first address (RD_v/ADD1) and a VM write command andfirst address (WR_v/ADD1).

The volatile memory 121 of the nonvolatile memory module 100 may outputdata DT_v and a tag TAG_v that are stored in an area, which correspondsto the first address ADD1, among an area of the volatile memory 121 inresponse to the VM read command RD_v. For example, as described above,the volatile memory 121 may drive a voltage of the memory data line MDQbased on data DT_v to output the data DT_v through the memory data lineMDQ. The volatile memory 121 may drive a voltage of the tag data lineTDQ based on a tag TAG to output the tag TAG through the tag data lineTDQ.

The processor 101 may output the write data DT_w through the data lineDQ. The nonvolatile memory module 100 may provide the write data DT_wreceived through the data line DQ to the volatile memory 121 or the NVMcontroller 122 through the memory data line MDQ and may provide thewrite data DT_w (or the tag TAG_w corresponding to the first addressADD1) to the volatile memory 121 through the tag data line TDQ. Thevolatile memory 121 or the NVM controller 122 may perform a programoperation or a write operation based on the received signals.

The flush operation may be selectively performed according to the tagTAG_v read from the volatile memory 121.

FIG. 5 is a flowchart illustrating a read operation of the nonvolatilememory module 100 of FIG. 2. Referring to FIGS. 1, 2, and 5, in stepS21, the processor 101 may send a module read command and address(RD/ADD).

In step S21, the nonvolatile memory module 100 may perform a readoperation about the volatile memory 121 in response to the receivedmodule read command and address (RD/ADD). For example, the module readcommand and address (RD/ADD) may include a read command for reading datastored in the nonvolatile memory module 1000 and a read addresscorresponding to the read data. The nonvolatile memory module 100 mayread data and a tag stored in an area, which corresponds to the readaddress, among an area of the volatile memory 121.

In step S22, the nonvolatile memory module 100 may determine whether acache hit or a cache miss occurs, based on a read result. As describedabove, the tag TAG may include partial information of an address. Thenonvolatile memory module 100 may compare the tag TAG and the receivedaddress and may determine whether a cache hit or a cache miss occurs,based on the comparison result. When a part of the received address isthe same as the tag TAG, the nonvolatile memory module 100 may determinethat the cache hit occurs. When a part of the received address isdifferent from the tag TAG, the nonvolatile memory module 100 maydetermine that the cache miss occurs.

In example embodiments, a read operation that is performed when thecache miss occurs will be described with reference to FIGS. 7 and 8.

When the cache hit occurs, in step S23, the nonvolatile memory module100 may send the data read from the volatile memory 121 and cacheinformation INFO to the processor 101. The cache information INFO mayinclude information about whether the output data corresponds to thecache hit or the cache miss. The processor 101 may determine whetherdata DT_v received through the cache information INFO is valid data.That is, the nonvolatile memory module 100 may provide the processor 101with information about the cache hit H as the cache information INFO sothat the processor 101 may recognize the read data as valid data.

In example embodiments, an operation of step S24 may be performed aftera time elapses from step S21. That is, the processor 101 may send themodule read command and address (RD/ADD) to the nonvolatile memorymodule 100 and may receive the read data from the nonvolatile memorymodule 100 after the time elapses. In this case, the time may be a readlatency RL. The read latency RL may be a time or a clock period that isdetermined according to the operating characteristic of the nonvolatilememory module 100. Information about the read latency RL may be storedin the SPD 140 and may be provided as the device information DI to theprocessor 101. The processor 101 may control the nonvolatile memorymodule 100 based on the read latency RL.

FIG. 6 is a timing diagram for describing, in detail, an operation ofFIG. 5. Referring to FIGS. 1, 2, 5, and 6, the nonvolatile memory module100 may a module read command and first address (RD/ADD1) from theprocessor 101 and may output an NVM command/address CA_n and a VMcommand/address CA_v in response to the received signal. In this case,the NVM command/address CA_n may include an NVM read command and firstaddress (RD_n/ADD1) for reading data stored in the nonvolatile memory123. The VM command/address CA_v may include a VM read command and firstaddress (RD_v/ADD1) for reading data stored in the volatile memory 121.

The volatile memory 121 may output data DT_v and a tag TAG_V that arestored in an area, which corresponds to the first address ADD1, among anarea of the volatile memory 121 in response to the VM read command andfirst address (RD_v/ADD1). For example, as described above, the volatilememory 121 may output the data DT_v through the memory data line MDQ bydriving a voltage of the memory data line MDQ on the basis of data DT_v.The volatile memory 121 may drive a voltage of the tag data line TDQ onthe basis of the tag TAG_v to output the tag TAG_v through the tag dataline TDQ.

The module controller 110 may receive the tag TAG_v through the tag dataline TDQ and may determine whether a cache hit or a cache miss occurs,based on a result of comparing the received tag TAG_v and the firstaddress ADD1.

When the cache hit occurs, the nonvolatile memory module 100 may outputthe data DT_v read from the volatile memory 121 and may output cacheinformation INFO including a cache hit H. The processor 101 may receivethe cache information INFO including the cache hit (H) information sothat it may recognize the data DT_v received through the cacheinformation INFO as valid data.

FIG. 7 is a flowchart illustrating another write operation of thenonvolatile memory module of FIG. 2. A read operation when a cache missoccurs will be described with reference to FIG. 7.

Referring to FIGS. 1, 2, 5, and 7, when a determination result of stepS23 indicates a cache miss, an operation of step S25 may be performed.In step S25, the nonvolatile memory module 100 may send data read fromthe volatile memory 121 and cache information INFO to the processor 101.In this case, the cache information INFO may include information about acache miss M.

In example embodiments, as described above, an operation of step S25 maybe performed after a read latency RL elapses from a point in time when amodule read command and address (RD/ADD) is received.

In step S26, the nonvolatile memory module 100 may perform a pre-readoperation about the nonvolatile memory 123. In example embodiments, thepre-read operation may indicate an operation in which the NVM controller122 reads data from the nonvolatile memory 123 and stores the read datain a data buffer included in the NVM controller 122. Alternatively, thepre-read operation may indicate an operation for preparing read data toallow the NVM controller 122 to output data from the nonvolatile memory123 within the read latency RL based on a command of the processor 101.That is, when the pre-read operation about the nonvolatile memory 123 iscompleted, the nonvolatile memory module 100 may output data, which isread from the nonvolatile memory 123, within the read latency RL inresponse to the command from the processor 101.

In example embodiments, the pre-read operation may be performed whileoperations of steps S22 to S25 are performed. Alternatively, when thecache miss occurs, the pre-read operation may be performed by the NVMcontroller 122. For example, the NVM controller 122 may receive a firstaddress ADD1 from the module controller 110 and may receive a tag TAGthrough the tag data line TDQ. The nonvolatile memory module 122 maycompare the tag TAG and the address ADD1 and may determine whether acache hit or a cache miss occurs, based on the comparison result. TheNVM controller 122 may perform the pre-read operation based on thedetermination result. In example embodiments, the NVM controller 122 maydetermines a cache miss or a cache hit after a tag TAG_v is output fromthe volatile memory 121.

After the pre-read operation is completed, in step S27, the nonvolatilememory module 100 may provide a ready signal R to the processor 101. Inexample embodiments, the ready signal R may be a signal indicating thatthe nonvolatile memory module 100 completes the pre-read operation. Theready signal R may be provided through a signal line through which thecache information INFO is transmitted or through a separate signal line.

In step S28, the processor 101 may provide the nonvolatile memory module100 with a read command and address (NRD/ADD) in response to the readysignal R. In example embodiments, the module read command NRD may bedifferent from the module read command RD of step S21. The module readcommand NRD may be a command/address for reading data from thenonvolatile memory 123.

In step S29, the nonvolatile memory module 100 may perform a readoperation about the nonvolatile memory 123 and a write operation aboutthe volatile memory 121 in response to the module read command andaddress (NRD/ADD). For example, the NVM controller 122 of thenonvolatile memory module 100 may drive the memory data line MDQ basedon data that is prepared during the pre-read operation. The volatilememory 121 may store data received from the NVM controller 122 throughthe memory data line MDQ (i.e., data output from the nonvolatile memory123). In this case, the write operation of the volatile memory 121 maybe a read caching operation.

In step S2a, the nonvolatile memory module 100 send data DT_n from thenonvolatile memory 123 to the processor 101. For example, thenonvolatile memory module 100 may output the data DT_n, which isreceived from the nonvolatile memory 123, through the data line DQ. Inexample embodiments, the operation of step S2a may be performed after atime elapses from an operation of step S28. The time may be a readlatency RL′. In example embodiments, the read latency RL′ of FIG. 7 maybe different from the read latency RL of FIG. 5. The read latencies RLand RL′ may be stored in the SPD 140 and may be provided as the deviceinformation DI to the processor 101.

FIG. 8 is a timing diagram for describing, in detail, the read operationof FIG. 7. For descriptive convenience, a duplicated description aboutthe above-described elements may be omitted.

Referring to FIGS. 1, 2, 5, 7, and 8, the nonvolatile memory module 100may receive a module read command and first address (RD/ADD1) from theprocessor 101. The module controller 110 of the nonvolatile memorymodule 100 may provide an NVM read command and first address (RD_n/ADD1)to the NVM controller 122 and a VM read command and first address(RD_v/ADD1) to the volatile memory 121 in response to the module readcommand and first address (RD/ADD1).

The volatile memory 121 may output data DT_v and a tag TAG_v that arestored in an area, which corresponds to the first address ADD1, among anarea of the volatile memory 121 through the memory data line MDQ inresponse to the VM read command and first address (RD_v/ADD1). That is,the volatile memory 121 may drive voltages of the memory data line MDQand the tag data line TDQ respectively based on the data DT_v and thetag TAG_v. The data DT_v on the memory data line MDQ may be outputthrough the data line DQ under control of the module controller 110 andthe data buffer 130.

The module controller 110 may compare the tag TAG_v and the firstaddress ADD1 and may determine whether the cache hit or the cache missoccurs, based on the comparison result. When the cache miss occurs, themodule controller 110 may send the cache information INFO about thecache miss M to the processor 101. In this case, the processor 101 mayrecognize that data DT_v received through the data line DQ is the cachemiss M.

The nonvolatile memory system A200 may perform the pre-read operation.In example embodiments, the NVM controller 122 may prepare data of anarea, which corresponds to a first address ADD1 among an area of thenonvolatile memory 123 in response to a nonvolatile memory read commandand the first address ADD1 from the module controller 110. When thepre-read operation is completed, the module controller 110 may send theready signal R to the processor 101. In example embodiments, the readysignal R may be provided to the processor 101 through the same line asthe cache information INFO, through a separate signal line, or throughthe data line DQ.

The processor 101 may send a module read command and first address(NRD/ADD1) to the nonvolatile memory module 100 in response to the readysignal R. The nonvolatile memory module 100 may provide an NVM readcommand and first address (RD_n′/ADD1) to the NVM controller 122 inresponse to the module read command and first address (NRD/ADD1). Inexample embodiments, the NVM read command that is issued according tothe module read command NRD may be different from the NVM read commandRD_n that is issued according to the module read command RD.

In example embodiments, each of the module read commands NRD and RD maybe a command that is defined by a communication protocol between theprocessor and the nonvolatile memory module 100.

The NVM controller 122 may output data DT_n, which is prepared duringthe pre-read operation, through the memory data line MDQ in response tothe NVM read command and first address (RD_n′/ADD1). In exampleembodiments, the NVM controller 122 may output the data DT_n and a tagTAG_n correspond thereto through the tag data line TDQ. In exampleembodiments, the tag TAG_n corresponding to the data DT_n may include apart of the first address ADD1 corresponding to the data DT_n. The dataDT_n on the memory data line MDQ may be output to the data line DQ undercontrol of the module controller 110 and the data buffer 130.

In example embodiments, the nonvolatile memory module 100 may performread caching while the data DT_n is output. For example, the modulecontroller 110 may provide the volatile memory 121 with a VM writecommand and first address (WR_v/ADD1) in response to a nonvolatilememory read command/address (NRD/ADD1).

In example embodiments, a time may exist between the VM write commandand first address (WR_v/ADD1) and an NVM read command and first address(RD_n′/ADD1). That is, the VM write command and first address(WR_v/ADD1) may be provided to the volatile memory 121 insynchronization with a point in time when the NVM controller 122 outputsthe data DT_n through the memory data line MDQ in response to the NVMread command and first address (RD_n′/ADD1).

The volatile memory 121 may write the data DT_n on the memory data lineMDQ and the tag TAG_n on the tag data line TDQ in an area, whichcorresponds to the first address ADD1 among an area of the volatilememory 121 in response to the VM write command and first address(WR_v/ADD1). Through the above-described read caching, a cache hit rateof the nonvolatile memory module may increase.

The above-described structures, write operations, or read operations ofthe nonvolatile memory module 100 are only an example and are variouslymodified or changed without departing from the scope of the inventiveconcept.

FIG. 9 is a drawing for describing a cache structure of the volatilememory of FIG. 2. For descriptive convenience, elements that are notused to describe a cache structure of the volatile memory 121 may beomitted. Furthermore, it is assumed that a storage area of thenonvolatile memory 123 is divided into first to fourth areas AR1 to AR4.The first to fourth areas AR1 to AR4 may be areas that are logicallydivided. The storage area of the nonvolatile memory 123 may furtherinclude a storage space as well as the first to fourth areas AR1 to AR4.

Referring to FIGS. 2 and 9, an access speed of the volatile memory 121may be faster than that of the nonvolatile memory 123. That is, a partof data stored in the nonvolatile memory 123 may be stored in thevolatile memory 121 so that a speed in which an access operation isperformed according to a request of the module controller 110 or theprocessor 101 may be improved. For example, the volatile memory 121 maybe used as a cache memory of the nonvolatile memory 123. That is, thevolatile memory 121 may store a part of data stored in the nonvolatilememory 123 and may output the stored data in response to according to arequest of the module controller 110 or the processor 101.

In example embodiments, the volatile memory 121 may have a directmapping relation with the nonvolatile memory 123. For example, thevolatile memory 121 may include a plurality of entries ET1 to ETn. Oneentry ET may indicate a storage space in which data and a tag TAG of acache line unit are stored. The cache line unit may indicate a minimumaccess unit of a request of the module controller 110 or the processor101. The volatile memory 121 may have a storage capacity thatcorresponds to the plurality of entries ET1 to ETn.

The nonvolatile memory device 1100 may include first to fourth areas AR1to AR4. The first area AR1 may include a plurality of cache lines CL11to CL1n, the second area AR2 may include a plurality of cache lines CL21to CL2n, the third area AR3 may include a plurality of cache lines CL31to CL3n, and the fourth area AR4 may include a plurality of cache linesCL41 to CL4n. In example embodiments, each of the cache lines CL11 toCL1n, CL21 to CL2n, CL31 to CL3n, and CL41 to CL4n may indicate astorage space of a data access unit corresponding to a request of theprocessor 101 or the module controller 110.

For example, the first area AR1 may include the cache lines CL11 toCL1n. The cache lines CL11 to CL1n may correspond to the entries EN1 toETn, respectively. That is, the first cache line CL11 may correspond tothe first entry ET1, and the second cache line CL12 may correspond tothe second entry ET2. The second area AR1 may include the cache linesCL21 to CL2n, which correspond to the plurality of entries ET1 to ETn,respectively. Likewise, the third area AR3 may include the cache linesCL31 to CL3n, which correspond to the plurality of entries ET1 to ETn,respectively. The fourth area AR4 may include the cache lines CL41 toCL4n, which correspond to the plurality of entries ET1 to ETn,respectively.

As described above, the volatile memory 121 may have a direct mappingrelation with the nonvolatile memory 123. The first entry ET1 of thevolatile memory 121 may correspond to the cache lines CL11, CL21, CL31,and CL41 of the first to fourth areas AR1 to AR4 and may store data DT_vstored in one among the cache lines CL11, CL21, CL31, and CL41 of thefirst to fourth areas AR1 to AR4. In other words, the data DT_v storedin the first entry ET1 may correspond to one among the cache lines CL11,CL21, CL31, and CL41 of the first to fourth areas AR1 to AR4.

The first entry ET1 may include a tag TAG about the stored data DT_v. Inexample embodiments, the tag TAG may be information indicating whetherthe data DT_v stored in the first entry ET1 corresponds to any one amongthe cache lines CL11, CL21, CL31, and CL41 of the first to fourth areasAR1 to AR4.

In example embodiments, each of the cache lines CL11 to CL1n, CL21 toCL2n, CL31 to CL3n, and CL41 to CL4n may be selected or distinguished byan address ADD provided from the processor 101. That is, at least oneamong the plurality of cache lines CL11 to CL1n, CL21 to CL2n, CL31 toCL3n, and CL41 to CL4n may be selected by the address ADD provided fromthe processor 101, and an access operation about the selected cache linemay be performed.

Each of the plurality of entries ET1 to ETn may be selected ordistinguished by at least a part of the address ADD provided from theprocessor 101. That is, at least one among the plurality of entries ET1to ETn may be selected by at least a part of the address ADD providedfrom the processor 101, and an access operation about the selected entrymay be performed.

The tag TAG may include at least a part of the address ADD provided fromthe processor 101 or the rest thereof. For example, the case that atleast one among the plurality of entries ET1 to ETn is selected by theaddress ADD and a tag TAG_v from the selected entry is included in theaddress ADD may be determined as being a cache hit H. For example, thecase that at least one among the plurality of entries ET1 to ETn isselected by the address ADD and a tag TAG_v from the selected entry isnot included in the address ADD may be determined as being a cache missM.

As described above, the nonvolatile memory module 100 may use thevolatile memory 121 as a cache memory so that the performance of thenonvolatile memory module 100 may be improved. In this case, thenonvolatile memory module 100 may determine whether a cache hit or acache miss occurs, based on a tag TAG stored in the volatile memory 121.

FIGS. 10 and 11 are block diagrams for describing, in detail, a writeoperation of FIG. 3. Referring to FIGS. 1, 10, and 11, the nonvolatilememory module A100 may include a module controller A110, a volatilememory A121, an NVM controller A122, a nonvolatile memory A123, and adata buffer A130. In example embodiments, the nonvolatile memory moduleA100 of FIG. 10 may be a device or module that is substantially the sameas or similar to the nonvolatile memory module 100 of FIGS. 1 and 2. Fordescriptive convenience, a detailed description about above-describedcomponents may be omitted.

The module controller A110 may receive a module write command and firstaddress (WR/ADD1) from the processor 101. The module controller A110 mayprovide an NVM write command and first address (WR_n/ADD1) to the NVMcontroller A122 and a VM read command and first address (RD_v/ADD1) tothe volatile memory A121 in response to the module write command andfirst address (WR/ADD1).

In example embodiments, at least a part of the first address ADD1 isassumed as corresponding to the first entry ET1 of the volatile memoryA121. That is, on the basis of the VM read command and first address(RD_v/ADD1), the volatile memory A121 may select or activate the firstentry ET1 and may output data DT_v and a tag TAG_v that are stored inthe first entry ET1.

The tag TAG_v stored in the first entry ET1 may be provided to themodule controller A110 and the NVM controller A122 through the tag dataline TDQ. The data DT_v stored in the first entry ET1 may be outputthrough the memory data line MDQ.

In example embodiments, the NVM controller A122 may compare the firstaddress ADD received from the module controller A110 and the tag TAG_vreceived through the tag data line TDQ and may determine whether a cachemiss or a cache hit occurs, based on the comparison result. When thecache miss occurs, the NVM controller A122 may receive (or fetch) thedata DT_v provided through the memory data line MDQ and may write thereceived data DT_v to the nonvolatile memory A123. That is, when thecache miss occurs during a write operation of the nonvolatile memorymodule A100, the NVM controller A122 may perform the flush operation.

In example embodiments, when the cache hit occurs, the nonvolatilememory module A100 may not perform the flush operation.

In example embodiments, the data DT_v of the first entry ET1 illustratedin FIG. 10 may not be provided to the processor 101. For example, thedata DT_v may be output through the memory data line MDQ, but it may notbe provided to the processor 101 through the data buffer A130.Alternatively, in the case in which the data buffer A130 is absent inthe nonvolatile memory module A100, even though the data DT_v isprovided through the data line DQ, the processor 101 may ignore the dataDT_v provided through the data line DQ. The reason is that the processor101 recognizes a write operation about the nonvolatile memory moduleA100.

As illustrated in FIG. 11, the module controller A110 may provide the VMwrite command and first address (WR_v/ADD1) to the volatile memory A121.As described above, at least a part of the first address ADD1 maycorrespond to the first entry ET1. That is, the volatile memory A121 mayselect or activate the first entry ET1 in response to the VM writecommand and first address (WR_v/ADD1).

The write data DT_w may be provided through the data line DQ, the databuffer A130, and the memory data line MDQ. In example embodiments, thewrite data DT_w may be provided to the processor 101 after a writelatency WL elapses from a point in time when a module writecommand/address CA_WR is received.

The module controller A110 may provide a write tag TAG_w to the volatilememory A121 through the tag data line TDQ. The write tag TAG_w mayinclude at least a part of the first address ADD1.

That is, on the basis of the VM write command and first address(WR_v/ADD1), the volatile memory A121 may select the first entry ET1 andmay write the write data DT_w and a write tag TAG_w in the first entryET1.

In example embodiments, the NVM controller A122 may receive the writedata DT_w through the memory data line MDQ and may program the receiveddata DT_w in the nonvolatile memory A123.

As described above, during a write operation, the nonvolatile memorymodule A100 may read the tag TAG_v stored in the volatile memory A121,may determine whether a cache hit or a cache miss occurs, based on theread tag TAG_v, and may perform the flush operation based on thedetermination result.

FIGS. 12 and 13 are block diagrams for describing, in detail, a readoperation of FIGS. 5 and 7. Referring to FIGS. 1, 12, and 13, thenonvolatile memory module A100 may include the module controller A110,the volatile memory A121, the NVM controller A122, the nonvolatilememory A123, and the data buffer A130. For descriptive convenience, adetailed description about above-described components may be omitted.

As illustrated in FIG. 12, the module controller A110 may receive amodule read command and first address (RD/ADD1) from the processor 101and may provide a VM read command and first address (RD_v/ADD1) to thevolatile memory A121 and an NVM read command and first address(RD_n/ADD1) to the NVM controller A121 in response to the receivedsignal.

As described above, at least a part of the first address ADD1 (i.e., theremaining address bits other than bits, which are associated with a tagTAG, among bits of the first address ADD1) may correspond to the firstentry ET1 of the volatile memory A121.

That is, on the basis of the VM read command and first address(RD_v/ADD1), the volatile memory A121 may select the first entry ET1 andmay output data DT_v and a tag TAG_v that are stored in the first entryET1. For example, the volatile memory A121 may send the tag TAG_v to theNVM controller A121 and the module controller A110 through the tag dataline TDQ and may output the data DT_v through the memory data line MDQ.

The module controller A110 may compare the first address ADD receivedfrom the processor 101 and the tag TAG_v received through the tag dataline TDQ and may determine whether a cache miss or a cache hit occurs,based on the comparison result. For example, the case that at least apart of the first address ADD1 is the same as the tag TAG_v may bedetermined by the module controller A110 as being a cache hit, and themodule controller A110 may output the cache information INFO about thecache hit. For example, the case that at least a part of the firstaddress ADD1 is not the same as the tag TAG_v may be determined by themodule controller A110 as being a cache miss, and the module controllerA110 may output the cache information INFO about the cache miss.

In example embodiments, as described with reference to FIGS. 6 and 8,the cache information INFO may be provided to the processor 101 togetherwith the data DT_v. The processor 101 may determine whether the receiveddata DT_v is valid data, based on the cache information INFO. Forexample, when the cache information INFO indicates a cache hit, theprocessor 101 may determine the received data DT_v as valid data. Whenthe cache information INFO indicates a cache miss, the processor 101 maydetermine the received data DT_v as invalid data. In this case, theprocessor 101 may perform any other operation to obtain valid data.

Example embodiments illustrated in FIG. 13 shows an operationcorresponding to the case that a cache miss occurs during a readoperation of the nonvolatile memory module A100. As illustrated in FIG.13, when a cache miss occurs, the NVM controller A122 may recognize theoccurrence of the cache miss. For example, as described above, the NVMcontroller A122 may receive the tag TAG_v through the tag data line TDQand may recognize the occurrence of the cache miss, based on a result ofcomparing the received tag TAG_v and at least a part of the firstaddress ADD1.

In this case, the NVM controller A122 may read data DT_n correspondingto the first address ADD1 from the nonvolatile memory A123 and mayprepare the read data DT_n. In example embodiments, to prepare data maymean to store data in a separate buffer or storage circuit such that theNVM controller A122 outputs the data within a time (e.g., the readlatency RL) in response to a command of the module controller A110.

After the NVM controller A122 prepares the data DT_n, the modulecontroller A110 may provide the ready signal R to the processor 101. Inexample embodiments, the ready signal R may be provided to the processor101 through the same line as the cache information INFO. Alternatively,the ready signal R may be provided to the processor 101 through aseparate signal line.

The processor 101 may provide the module read command and first address(NRD/ADD1) for reading cache-missed data to the module controller A110in response to the ready signal R. In this case, the module read commandNRD of FIG. 13 may be different from the module read command RD of FIG.12. For example, the module read command NRD of FIG. 13 may be a commandand address that is used to read data DT_n stored in the nonvolatilememory A123 of the nonvolatile memory module A110.

The module controller A110 may provide an NVM read command and firstaddress (RD_n′/ADD1) to the NVM controller A122 and a VM write commandand first address (WR_v/ADD1) to the volatile memory A121 in response tothe module read command and first address (NRD/ADD1). The NVM controllerA122 may output the prepared data DT_n through the memory data line MDQin response to the NVM read command and first address (RD_n′/ADD1).

The data DT_n output through the memory data line MDQ may be provided tothe data buffer A130, and the data buffer A130 may output the data DT_nthrough the data line DQ under control of the module controller A110. Inexample embodiments, the data DT_n may be output to the data signals DQafter a time (e.g., the read latency RL) elapses from a point in timewhen the module read command and first address (NRD/ADD1) is provided tothe nonvolatile memory module A100.

In example embodiments, the volatile memory A121 may write the write tagTAG_w and the data DT_n in the first entry ET1 in response to the VMwrite command and first address (WR_v/ADD1). For example, the modulecontroller A110 may output the write tag TAG_w through the tag data lineTDQ. The write tag TAG_w may include at least a part of the firstaddress ADD1. The write tag TAG_w may be a tag that corresponds to thedata DT_n from the nonvolatile memory A123. The volatile memory A121 mayselect the first entry ET1 in response to the VM write command and firstaddress (WR_v/ADD1). The volatile memory A121 may write the write tagTAG_w received through the tag data line TDQ and the data DT_n receivedthrough the memory data line MDQ in the first entry ET1. That is, thevolatile memory A121 may perform the read caching operation.

FIG. 14 is a flowchart illustrating a read operation of the nonvolatilememory module of FIG. 2, according to example embodiments of theinventive concept. For descriptive convenience, a detailed descriptionabout above-described components may be omitted. Referring to FIGS. 2and 14, the nonvolatile memory module A100 may receive a module readcommand and first address (RD/ADD1) and may send a VM read command andfirst address (RD_v/ADD1) to the volatile memory A121 and an NVM readcommand and first address (RD_n/ADD1) to the NVM controller A121respectively in response to the received signal (RD/ADD1).

The volatile memory A121 may output data DT_v and a tag TAG_v inresponse to the VM read command and first address (RD_v/ADD1). In thiscase, the tag TAG_v may be different from at least a part of the firstaddress ADD1. This may mean that a cache miss M occurs. The modulecontroller A110 may send the cache information INFO about the cache missM to the processor 101.

In example embodiments, unlike a read operation of FIG. 8, in exampleembodiments of FIG. 14, the module controller A110 may not provide theready signal R separately. In this case, the processor 101 mayperiodically poll status information of the nonvolatile memory moduleA110 to recognize a data-ready state. In example embodiments, anoperation of polling status information of the nonvolatile memory moduleA100 may be accomplished by accessing a separate status registerincluded in the nonvolatile memory module A110 at the processor 101 oraccessing an area of the nonvolatile memory module A100 at the processor101.

When recognizing, through a periodic polling operation or a status readoperation, that data is prepared in the nonvolatile memory module A100,the processor 101 may provide the module read command and first address(NRD/ADD1) to the nonvolatile memory module A100. An operation that thenonvolatile memory module A100 performs in response to the module readcommand and first address (NRD/ADD1) is described with reference to FIG.13, and a detailed description thereof is thus omitted.

As described above, even though the nonvolatile memory module A100 doesnot provide the ready signal R upon the occurrence of the cache miss, aread operation may be performed normally through the polling operationof the processor 101.

FIG. 15 is a block diagram illustrating the nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.Referring to FIG. 15, the nonvolatile memory module A200 may include amodule controller A210, a volatile memory A221, an NVM controller A222,a nonvolatile memory A223, and a data buffer A230. For descriptiveconvenience, a detailed description about above-described components maybe omitted.

Unlike the module controller A110 of the nonvolatile memory module A100of FIG. 10, the module controller A210 of the nonvolatile memory moduleA200 of FIG. 15 may further include a cache manager CM.

The cache manager CM may manage the volatile memory A221 as a cachememory of the nonvolatile memory A223 effectively. For example, when acache miss occurs during a read operation of the nonvolatile memorymodule A100, the cache manager CM may manage cache-missed addressinformation. Afterwards, when a read operation about the cache-missedaddress is performed, the cache manager CM may control an NVMcommand/address CA_n and a VM command/address CA_v such that datacorresponding to the cache-missed address is output from the nonvolatilememory A223.

That is, as described with reference to FIG. 13, even though theprocessor 101 does not provide a separate module read command/addressCA₁₃ NRD for reading data from the nonvolatile memory A223, during theread operation about the cache-missed address, the cache manager CM maycontrol the NVM command/address CA_n and the VM command/address CA_vsuch that data is output from the nonvolatile memory A223.

FIG. 16 is a flowchart illustrating a read operation of the nonvolatilememory module of FIG. 15. For descriptive convenience, a detaileddescription about above-described components may be omitted.

Referring to FIGS. 1, 15, and 16, in step AS210, the nonvolatile memorymodule A200 may receive a module read command and address (RD/ADD) fromthe processor 101.

In step AS220, the nonvolatile memory module A200 may determine whethera cache hit or a cache miss occurs. For example, as described above, thenonvolatile memory module A200 may determine whether a cache hit or acache miss occurs, based on a tag stored in an entry, which correspondsto the address ADD received from the processor 101, among a plurality ofentries of the volatile memory A221.

If no cache miss occurs (i.e., if the cache hit occurs), in step AS230,the nonvolatile memory module A200 may output data DT_v of the volatilememory A221 and cache information INFO. For example, the nonvolatilememory module A200 may provide the processor 101 with data DT_v storedin an entry corresponding to the address ADD received from the processor101 and the cache information INFO. In this case, the cache informationINFO may include information about a cache miss M.

If the cache miss occurs, in step AS240, the nonvolatile memory moduleA200 may output data DT_v of the volatile memory A221 and cacheinformation INFO. In example embodiments, the cache information INFO ofstep AS240 may include information about a cache miss M.

In step AS250, the nonvolatile memory module A200 may receive a moduleread command and address (RD/ADD′) from the processor 101.

In step AS260, the nonvolatile memory module A200 may determine whetherthe address ADD′ received in step AS250 is a previously cache-missedaddress. For example, if the determination result of step AS220indicates that the cache miss occurs, the cache manager CM may manageinformation about the cache-missed address information. The cachemanager CM may compare the received address and the cache-missed addressto determine whether the received address is the cache-missed address.

If the received address is not the cache-missed address, the nonvolatilememory module A200 may perform an operation of step AS220.

If the received address is the cache-missed address, in step AS270, thenonvolatile memory module A200 may output data DT_n of the nonvolatilememory A223. Furthermore, the nonvolatile memory module A200 may performthe read caching operation. For example, when a cache-missed address isreceived, data corresponding to the received address ADD′ may be absentin the volatile memory A221. That is, the nonvolatile memory module A200may control an NVM command/address such that data DT_n corresponding tothe received address ADD′ is output from the nonvolatile memory A223.

FIG. 17 is a timing diagram for describing a read operation of FIG. 16.For descriptive convenience, a detailed description aboutabove-described components may be omitted. Referring to FIGS. 15 to 17,after a cache miss M occurs, the nonvolatile memory module A200 may sendthe ready signal R to the processor 101. In example embodiments, theready signal R may be a signal indicating that data corresponding to acache-missed address is prepared.

Afterwards, the processor 101 may provide the nonvolatile memory moduleA200 with a module read command and first address (RD/ADD1) in responseto the ready signal R. In this case, the module read command and firstaddress (RD/ADD1) may be the same as a previous module read command andfirst address (RD/ADD1).

As described above, the first address ADD1 may be a cache-missedaddress. The cache manager CM may manage information about thecache-missed address. The cache manager CM may recognize that the firstaddress ADD1 received is the cache-missed address and may control theNVM command/address CA_n and the VM command/address CA_v in response tothe module read command and first address (RD/ADD1) such that data DT_nis output from the nonvolatile memory A223.

As described above, because the cache manager CM manages thecache-missed address, even though a separate command for reading datafrom the nonvolatile memory A223 is not provided, the nonvolatile memorymodule A200 may perform a normal read operation.

FIG. 18 is a flowchart illustrating a read operation of the nonvolatilememory module of FIG. 15, according to example embodiments of theinventive concept. Referring to FIGS. 1, 15, and 18, the nonvolatilememory module A200 may perform operations of steps AS310 to AS340.Operations of steps AS310 to AS340 may be similar to those of stepsAS210 to AS240 of FIG. 16, and a detailed description thereof is thusomitted.

In step AS350, the nonvolatile memory module A200 may assign transactionidentification TID to a cache-missed address. For example, the cachemanager CM may assign the transaction identification TID to thecache-missed address. In example embodiments, the transactionidentification TID may monotonically increase whenever a cache-missedaddress occurs.

In step AS360, the nonvolatile memory module A200 may output statusinformation of the transaction identification TID in response to arequest of the processor 101. For example, when a cache miss occursduring a read operation about the first address ADD1 data DT_n may beprepared such that data corresponding to the first address ADD1 isoutput from the nonvolatile memory A223. When the data DT_n is prepared,the cache manager CM may output status information of the transactionidentification TID corresponding to the first address ADD1 as a state of“ready”. The processor 101 may receive the status information of thetransaction identification TID and may recognize that data correspondingto the transaction identification TID is prepared.

In example embodiments, the status information about a plurality oftransaction identification TID may be implemented in the form of bitmap,and the nonvolatile memory module A200 may send the status informationabout the plurality of transaction identification TID at the same timein response to a request of the processor 101.

In step AS370, the nonvolatile memory module A200 may receive a module amodule read command and transaction identification (RD, TID) from theprocessor 101. For example, the processor 101 may receive the statusinformation of the transaction identification TID and may recognize theprepared transaction identification TID based on the received statusinformation. To read data corresponding to the prepared transactionidentification TID, the processor 101 may send the module read commandand transaction identification (RD, TID) to the nonvolatile memorymodule A200.

In AS380, the nonvolatile memory module A200 may output datacorresponding to the transaction identification TID from the nonvolatilememory in response to the module read command and transactionidentification (RD, TID). For example, the nonvolatile memory moduleA200 may control the NVM command/address CA_n and the VM command/addressCA_v such that data corresponding to the received transactionidentification TID is output from the nonvolatile memory A223. Inexample embodiments, data from the nonvolatile memory A223 and thetransaction identification TID corresponding thereto may be togethersent to the processor 101.

FIG. 19 is a diagram for describing a transaction identificationassigning operation according to a read operation of FIG. 18. Referringto FIGS. 1, 15, and 19, the cache manager CM of the nonvolatile memorymodule A200 may manage transaction identifications TID aboutcache-missed addresses.

For example, the nonvolatile memory module A200 may sequentially performread operations about first to sixth addresses ADD1 to ADD6 in responseto a request of the processor 101. A cache miss may occur during a readoperation about the first address ADD1 In this case, the cache managerCM may assign a first transaction identification TID1 to the firstaddress ADD1 cache-missed. Afterwards, a cache hit may occur during aread operation about the second address ADD2. In this case, the cachemanager CM may not perform a separate operation. Afterwards, a cachemiss may occur during a read operation about the third address ADD3. Inthis case, the cache manager CM may assign a second transactionidentification TID2 to the third address ADD3 cache-missed. A cache hitmay occur when each of read operations about the fourth and fifthaddresses ADD4 and ADD5 is performed; when a cache miss occurs during aread operation about the sixth address ADD6, the cache manager CM mayassign a third transaction identification TID3 to the sixth addressADD6. Each of the first to third transaction identifications TID1, TID2,and TID3 may be implemented to be increased monotonically.

That is, the cache manager CM may manage cache-missed addresses, andwhenever a cache miss occurs, the cache manager CM may assign a transactidentification TID to the cache-missed address. In this case, thetransaction identification may increase monotonically.

FIG. 20 is a timing diagram for describing, in detail, the readoperation of FIG. 18. For descriptive convenience, a detaileddescription about above-described components may be omitted. Referringto FIGS. 1, 15, 18, and 20, the nonvolatile memory module A200 mayreceive a module read command and first address (RD/ADD1) and a moduleread command and second address (RD/ADD2) from the processor 101.

The module controller A210 of the nonvolatile memory module A200 mayprovide an NVM read command and first address (RD_n/ADD1) to the NVMcontroller A222 and a VM read command and first address (RD_v/ADD1) tothe volatile memory A221 in response to the module read command andfirst address (RD/ADD1). The volatile memory A221 may output first dataDT_v1 and a first tag TAG_v1 in response to the VM read command andfirst address (RD_v/ADD1). Likewise, the module controller A210 of thenonvolatile memory module A200 may provide an NVM read command andsecond address (RD_n/ADD2) to the NVM controller A222 and a VM readcommand and second address (RD_v/ADD2) to the volatile memory A221 inresponse to the module read command and second address (RD/ADD2). Thevolatile memory A221 may output second data DT_v2 and a second tagTAG_v2 in response to the VM read command and second address(RD_v/ADD2).

The first and second data DT_v1 and DT_v2 from the volatile memory A221may not be data corresponding to the first and second addresses ADD1 andADD2. That is, a cache miss may occur during read operations about thefirst and second addresses ADD1 and ADD2. In this case, the cachemanager CM may assign a first transaction identification TID1 and asecond transaction identification TID2 to the first address ADD1 and thesecond address ADD2, respectively.

As described above, the NVM controller A222 may receive the first andsecond tags Tag TAG_v1 and TAG_v2 and may recognize that a cache missoccurs, based on the first and second tags Tag TAG_v1 and TAG_v2. Inthis case, the NVM controller A222 may prepare data corresponding to thefirst and second addresses ADD1 and ADD2 from the nonvolatile memoryA223.

In example embodiments, when the NVM controller A22 prepares data DT_n1corresponding to the first address ADD1 firstly, the nonvolatile memorymodule A200 may provide the ready signal R to the processor 101. Theprocessor 101 may provide the nonvolatile memory module A200 with astatus read command RD_STS in response to the ready signal R.

The nonvolatile memory module A200 may send status information about atransaction identification TID to the processor 101 through a memorydata line MDQ and a data signal DQ in response to the status readcommand RD_STS. In example embodiments, the status read command RD_STSmay be a command that is previously defined to read an area, a statusregister, or a multi-purpose register of the nonvolatile memory moduleA200. In example embodiments, the status information about thetransaction identification TID may be stored in the area, statusregister, or multi-purpose register of the nonvolatile memory moduleA200. In example embodiments, the status information about thetransaction identification TID may be implemented in the form of bitmap.

In example embodiments, the nonvolatile memory module A200 may sendinformation about complete preparation of the first transactionidentification TID1 as status information about a transactionidentification TID. The processor 101 may provide the nonvolatile memorymodule A200 with a module read command and first transactionidentification TID1 in response to the received status information.

Responsive to the module read command and first transactionidentification (RD/TID1), the nonvolatile memory module A200 may providethe NVM command/address CA_n and the VM command/address CA_v such thatdata DT_n corresponding to the first transaction identification TID1 isoutput from the nonvolatile memory A223. In example embodiments, asdescribed with reference to FIG. 13, a read caching operation may beperformed together with the above-described operation.

In example embodiments, the NVM controller A222 may include informationabout a cache-missed address and a transaction identification, and theNVM command/address CA_n may include an NVM read command and firsttransaction identification. That is, the NVM controller A222 may outputdata DT_n (i.e., data corresponding to the first address ADD1)corresponding to the first transaction identification TID1 based on theinformation about a cache-missed address and a transactionidentification.

FIG. 21 is a drawing illustrating, in detail, a tag according to exampleembodiments of the inventive concept. For descriptive convenience, adetailed description about elements described with reference to FIG. 9is omitted.

Referring to FIGS. 2 and 21, the volatile memory 121 may include aplurality of entries ET1′ to ETn′. The nonvolatile memory 123 mayinclude the first to fourth areas AR1 to AR4. The first area AR1 mayinclude a plurality of cache lines CL11 to CL1n, the second area AR2 mayinclude a plurality of cache lines CL21 to CL2n, the third area AR3 mayinclude a plurality of cache lines CL31 to CL3n, and the fourth area AR4may include a plurality of cache lines CL41 to CL4n.

In example embodiments, unlike the plurality of entries ET1 to ETndescribed with reference to FIG. 9, each of the plurality of entriesET1′ to ETn′ may include data DT_v, a tag TAG, a data error correctioncode ECC_DT, a tag error correction code ECC_TAG, and dirty informationDRT.

The tag TAG may be at least a part of an address corresponding to dataDT_v stored in the same entry. The data error correction code ECC_DT maybe an error correction code about the data DT_v stored in the sameentry. The tag error correction code ECC_TAG may be an error correctioncode about the tag TAG stored in the same entry. The dirty informationDRT may indicate dirty information about the data DT_v stored in thesame entry.

In example embodiments, the tag TAG, the data error correction codeECC_DT, the tag error correction code ECC_TAG, and the dirty informationDRT may be stored in tag-dedicated volatile memories, respectively.During a read operation or during a read operation of unit data, the tagTAG, the data error correction code ECC_DT, the tag error correctioncode ECC_TAG, and the dirty information DRT may be provided to a modulecontroller, an NVM controller, or a tag control circuit through the tagdata line TDQ.

In example embodiments, during a read operation or a write operation,the nonvolatile memory module 100 may selectively perform a flushoperation or a read caching operation based on the tag TAG and the dirtyinformation DRT. In example embodiments, the flush operation may referto an operation of programming data of the volatile memory 121 in thenonvolatile memory 123, and the read caching operation may refer to anoperation of writing data of the nonvolatile memory 123 in the volatilememory 121.

In example embodiments, during a write operation of the nonvolatilememory module 100, the nonvolatile memory module 100 may determinewhether a cache hit or a cache miss occurs, based on the tag TAG. Whenthe cache hit occurs, the nonvolatile memory module 100 may not skip theflush operation. When the cache miss occurs, the nonvolatile memorymodule 100 may selectively perform the flush operation based on thedirty information DRT. For example, when the cache miss occurs and whendata of the volatile memory 121 is at a dirty state, the nonvolatilememory module 100 may perform the flush operation to secure integrity ofdata of the volatile memory 121. When the cache miss occurs and whendata of the volatile memory 121 is not at a dirty state, the nonvolatilememory module 100 may skip the flush operation.

In example embodiments, during a read operation of the nonvolatilememory module 100, whether a cache hit or a cache miss occurs may bedetermined, based on the tag TAG of the nonvolatile memory module 100.When the cache hit occurs, the nonvolatile memory module 100 may notskip the flush operation and the read caching operation. When the cachemiss occurs, the nonvolatile memory module 100 may selectively performthe flush operation or the read caching operation based on the dirtyinformation DRT. For example, when the cache miss occurs and when dataof the volatile memory 121 is at a dirty state, the nonvolatile memorymodule 100 may perform the flush operation before the read cachingoperation. When the cache miss occurs and when data of the volatilememory 121 is not at a dirty state, the nonvolatile memory module 100may perform the read caching operation without the flush operation.

The following table shows whether to perform the flush operation and theread caching operation of the nonvolatile memory based on a cache hit, acache miss, and a dirty state.

TABLE 1 Dirty state Clean state Cache hit Flush operation Optional Flushoperation Optional Read caching Optional Read caching Optional Cachemiss Flush operation Mandatory Flush operation Optional Read cachingOptional Read caching Optional

As understood from table 1, when the cache miss occurs and when data ofthe volatile memory 121 is at a dirty state, the nonvolatile memorymodule 100 may perform the flush operation to secure integrity of dataof the volatile memory 121.

The above-described timing diagrams, block diagrams, and the like are todescribe example embodiments of the inventive concept easily, andexample embodiments of the inventive concept may not be limited thereto.In example embodiments, steps of write and read operations of thenonvolatile memory module according to example embodiments of theinventive may be performed according to a given timing. Informationabout the given timing may be stored in the SPD 140 (refer to FIG. 2)and may be provided to the processor 101 as the device information DI(refer to FIG. 2). In addition, various commands according to exampleembodiments may be commands that are previously defined according toproperty of the nonvolatile memory module. Information about the variouscommands may be stored in the SPD 140 and may be provided to theprocessor 101 as the device information DI.

FIG. 22 is a block diagram illustrating a nonvolatile memory included inthe nonvolatile memory module according to the inventive concept.Referring to FIG. 22, a nonvolatile memory 1100 may include a memorycell array 1110, an address decoder 1120, a control logic circuit 1130,a page buffer 1140, and an input/output (I/O) circuit 1150.

The memory cell array 1110 may include a plurality of memory blocks,each of which has a plurality of memory cells. The plurality of memorycells may be connected with a plurality of word lines WL. Each memorycell may be a single level cell (SLC) storing one bit or a multi-levelcell (MLC) storing at least two bits.

The address decoder 1120 may receive and decode an address ADDR from theNVM controller 112 (refer to FIG. 2). In example embodiments, theaddress ADDR received from the NVM controller 112 may be a physicaladdress indicating a physical location of a storage area of thenonvolatile memory 1100. The address decoder 1120 may select at leastone among the word lines WL based on the decoded address and may drive avoltage of the selected word line.

The control logic circuit 112 may control the address decoder 1120, thepage buffer 1140, and the input/output circuit 1150 in response to acommand CMD and a control logic CTRL received from the NVM controller112 (refer to FIG. 2).

The page buffer 1140 may be connected with the memory cell array 1110through a plurality of bit lines BL and may be connected with theinput/output circuit 1150 through a plurality of data lines DL. The pagebuffer 1140 may sense voltages of the plurality of bit lines BL and maystore data stored in the memory cell array 1110. Alternatively, the pagebuffer 1140 may control voltages of the plurality of bit lines BL basedon data received through the plurality of data lines DL.

The input/output circuit 1150 may receive data from the NVM controller112 under control of the control logic circuit 1130 and may send thereceived data to the page buffer 1140. Alternatively, the input/outputcircuit 1150 may receive data from the page buffer 1140 and may send thereceived data to the NVM controller 112.

In example embodiments, the NVM controller 122 may generate an addressADDR, a command CMD, and a control signal CTRL based on an NVMcommand/address CA_v from the module controller 110 (refer to FIG. 2).

FIG. 23 is a circuit diagram illustrating a first memory block of thememory blocks included in the nonvolatile memory of the nonvolatilememory module according to example embodiments of the inventive concept.In example embodiments, a first memory block BLK1 having athree-dimensional structure will be described with reference to FIG. 23.However, example embodiments of the inventive concept are not limitedthereto. For example, the remaining memory blocks may have a structuresimilar to the first memory block BLK1.

Referring to FIG. 23, the first memory block BLK1 may include aplurality of cell strings CS11, CS12, CS21, and CS22. The cell stringsCS11, CS12, CS21, and CS22 may be arranged along a row direction and acolumn direction and may form rows and columns.

Each of the cell strings CS11, CS12, CS21, and CS22 may include aplurality of cell transistors. Each of the cell strings CS11, CS12,CS21, and CS22 may include string selection transistor SSTa and SSTb, aplurality of memory cells MC1 to MC8, ground selection transistors GSTaand GSTb, and dummy memory cells DMC1 and DMC2. In example embodiments,each of the memory cells included in the cell strings CS11, CS12, CS21,and CS22 may be a charge trap flash (CTF) memory cell.

The plurality of memory cells MC1 to MC8 may be serially connected andmay be stacked in a height direction being a direction perpendicular toa plane defined by the row direction and the column direction. Thestring selection transistors SSTa and SSTb may be serially connected andmay be disposed between the memory cells MC1 to MC8 and bit lines BL1and BL2. The ground selection transistors GSTa and GSTb may be seriallyconnected and may be disposed between the memory cells MC1 to MC8 and acommon source line CSL.

In example embodiments, a first dummy memory cell DMC1 may be disposedbetween the memory cells MC1 to MC8 and the ground selection transistorsGSTa and GSTb. In example embodiments, a second dummy memory cell DMC2may be disposed between the memory cells MC1 to MC8 and the stringselection transistors SSTa and SSTb.

The ground selection transistors GSTa and GSTb of the cell strings CS11,CS12, CS21, and CS22 may be connected in common to a ground selectionline GSL. In example embodiments, ground selection transistors in thesame row may be connected to the same ground selection line, and groundselection transistors in different rows may be connected to differentground selection lines. For example, the first ground selectiontransistors GSTa of the cell strings CS11 and CS12 in the first row maybe connected to the first ground selection line, and the first groundselection transistors GSTa of the cell strings CS21 and CS22 in thesecond row may be connected to the second ground selection line.

In example embodiments, ground selection transistors provided at thesame height from a substrate may be connected to the same groundselection line, and ground selection transistors provided at differentheights may be connected to different ground selection lines. Forexample, the first ground selection transistors GSTa of the cell stringsCS11, CS12, CS21, and CS22 may be connected to the first groundselection line, and the second ground selection transistors GSTb thereofmay be connected to the second ground selection line.

Memory cells placed at the same height from the substrate or the groundselection transistors GSTa and GSTb may be connected in common to thesame word line, and memory cells placed at different heights therefrommay be connected to different word lines. For example, memory cells MC1to MC8 of the cell strings CS11, CS12, CS21, and CS22 may be connectedto first to eighth word lines WL1 to WL8.

String selection transistors, belonging to the same row, among the firststring selection transistors SSTa at the same height may be connected tothe same string selection line, and string selection transistorsbelonging to different rows may be connected to different stringselection lines. For example, the first string selection transistorsSSTa of the cell strings CS11 and CS12 in the first row may be connectedin common to the string selection line SSL1 a, and the first stringselection transistors SSTa of the cell strings CS21 and CS22 in thesecond row may be connected in common to the string selection line SSL2a.

Likewise, string selection transistors, belonging to the same row, amongthe second string selection transistors SSTb at the same height may beconnected to the same string selection line, and string selectiontransistors in different rows may be connected to different stringselection lines. For example, the second string selection transistorsSSTb of the cell strings CS11 and CS12 in the first row may be connectedin common to a string selection line SSL1 b, and the second stringselection transistors SSTb of the cell strings CS21 and CS22 in thesecond row may be connected in common to a string selection line SSL2 b.

In example embodiments, dummy memory cells at the same height may beconnected with the same dummy word line, and dummy memory cells atdifferent heights may be connected with different dummy word lines. Forexample, the first dummy memory cells DMC1 may be connected to a firstdummy word line DWL1, and the second dummy memory cells DMC2 may beconnected to a second dummy word line DWL2.

The first memory block BLK1 illustrated in FIG. 23 may be an example.For example, the number of cell strings may increase or decrease, andthe number of rows of cell strings and the number of columns of cellstrings may increase or decrease according to the number of cellstrings. In the first memory block BLK1, the number of cell strings(GST, MC, DMC, SST, or the like) may increase or decrease, and a heightof the first memory block BLK1 may increase or decrease according to thenumber of cell transistors. Furthermore, the number of lines (GSL, WL,DWL, SSL, or the like) connected with cell transistors may increase ordecrease according to the number of cell strings (GST, MC, DMC, SST, orthe like).

In example embodiments, the nonvolatile memory according to exampleembodiments may not be limited to the above-described configuration. Inexample embodiments, the nonvolatile memory may include athree-dimensional memory array. The 3-dimensional memory array may bemonolithically formed in one or more physical level(s) of a memory cellarray having an active area arranged on a circuit related on a siliconsubstrate and an operation of memory cells. The circuit related on anoperation of memory cells may be located in a substrate or on asubstrate. A term “monolithically” may mean that layers of each level ina 3-dimensional array are directly deposited on layers of low-level inthe 3-dimensional array.

According to example embodiments of the inventive concept, the3-dimensional memory array may have a vertical-directionalcharacteristic, and may include vertical NAND strings in which at leastone memory cell is located on another memory cell. The at least onememory cell may include a charge trap layer. Each vertical NAND stringmay include at least one select transistor located over memory cells.The at least one select transistor having the same structure with thememory cells and being formed monolithically together with the memorycells.

The following patent documents, which are hereby incorporated byreference, describe suitable configurations for three-dimensional memoryarrays, in which the three-dimensional memory array is configured as aplurality of levels, with word lines and/or bit lines shared betweenlevels: U.S. Pat. Nos. 7,679,133; 8,553,466; 8,654,587; 8,559,235; andUS Pat. Pub. No. 2011/0233648.

FIG. 24 is a block diagram illustrating a volatile memory of thenonvolatile memory module according to example embodiments of theinventive concept. Referring to FIG. 24, a volatile memory 1200 mayinclude a memory cell array 1210, an address buffer 1220, a row decoder(X-decoder) 1230, a column decoder (Y-decoder) 1240, a sense amplifierand write driver (SA/WD) 1250, and an input/output (I/O) circuit 1260.

The memory cell array 1210 may include a plurality of memory cells,which are connected with a plurality of word lines WL and a plurality ofbit lines BL. The plurality of memory cells may be arranged atintersections of the word lines and the bit lines, respectively. Inexample embodiments, each of the plurality of memory cells may include astorage capacitor and an access transistor.

The address buffer 1220 may receive and temporarily store an address ADDfrom the module controller A110. In example embodiments, the addressbuffer 1220 may provide a row address ADD_row of the received addressADD to the X-decoder 1230 and may provide a column address ADD_colthereof to the Y-decoder 1240.

The X-decoder 1230 may be connected to the memory cell array 1210through the bit lines BL. The X-decoder 1230 may activate at least one,which corresponds to the row address ADD_row, among the plurality ofword lines WL in response to a row address strobe signal RAS from themodule controller A110.

The Y-decoder 1240 may receive the column address ADD_col from theaddress buffer 1220. When a column address strobe signal CAS isreceived, the Y-decoder 1240 may control the sense amplifier and writedriver 1250 based on the column address ADD_col.

The sense amplifier and write driver 1250 may be connected to the memorycell array 1210 through the plurality of bit lines BL. The senseamplifier and write driver 1250 may sense a voltage change of each bitline. Alternatively, the sense amplifier and write driver 1250 maycontrol voltages of the plurality of bit lines based on data receivedfrom the input/output circuit 1260.

The input/output circuit 1260 may receive data from the sense amplifierand write driver 1250 and may output the received data through thememory data line MDQ (or the data line DQ). Alternatively, theinput/output circuit 1260 may receive data through the memory data lineMDQ (or the data line DQ) and may provide the received data to the senseamplifier and write driver 1250.

In example embodiments, the address ADD may be a VM command/address CA_vprovided from the module controller A110. The row address strobe signalRAS and the column address strobe signal CAS may be signals that areincluded in the VM command/address CA_v provided from the modulecontroller A110.

FIG. 25 is a drawing illustrating a server system to which thenonvolatile memory system according to example embodiments of theinventive concept is applied. Referring to FIG. 25, a server system 2000may include a plurality of server racks 2100. Each of the server racks2100 may include a plurality of nonvolatile memory modules 2200. Thenonvolatile memory modules 2200 may be directly connected withprocessors respectively included in the server racks 2100. For example,the nonvolatile memory modules 2200 may have the form of a dual in-linememory module and may be mounted on a DIMM socket electrically connectedwith a processor to communicate with the processor. In exampleembodiments, the nonvolatile memory modules 2200 may be used as storageof the server system 2000. In example embodiments, each of the pluralityof nonvolatile memory modules 2200 may be a nonvolatile memory moduledescribed with reference to FIGS. 1 to 24 or may operate according to anoperation method described with reference to FIGS. 1 to 24.

FIG. 26 is a block diagram illustrating a user system to which thenonvolatile memory module according to example embodiments of theinventive concept is applied. Referring to FIG. 26, a computing system3000 may include a processor 3001 and a plurality of memories 3110 to3140.

The processor 3001 may include a memory controller 3002. The memorycontroller 3002 may communicate with the memories 3110 and 3140 throughone bus 3003. In example embodiments, the bus 3003 may include dedicatedbuses that are respectively connected with the plurality of memories3110 to 3140 or a shared bus shared by the plurality of memories 3110 to3140. In example embodiments, the bus 3003 may include at least oneamong the data line DQ, the memory data line MDQ, and the tag data lineTDQ described with reference to FIGS. 1 to 25.

In example embodiments, a part the plurality of memories 3110 to 3140may be a nonvolatile memory module described with reference to FIGS. 1to 25 or may operate according to an operation method described withreference to FIGS. 1 to 25.

Alternatively, a part of the plurality of memory modules 3110 to 3140may include a nonvolatile memory, and the others thereof may include avolatile memory. A memory module including a volatile memory may be usedas a cache memory of a memory module including a nonvolatile memory.That is, as described with reference to FIGS. 1 to 25, a part of theplurality of memory modules 3110 to 3140 may be used as a main memory ofthe user system 3000, and the others thereof may be used as a cachememory. Memories used as a cache memory may be a volatile memorydescribed with reference to FIGS. 1 to 25 or may operate the same as avolatile memory described with reference to FIGS. 1 to 25.

In example embodiments, the memory controller 3002 may be a memorycontroller or a controller described with reference to FIGS. 1 to 25 ormay operate the same as a memory controller described with reference toFIGS. 1 to 25.

FIG. 27 is a block diagram illustrating a nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept. Forease of illustration, elements (e.g., a module controller and an SPD)other than a heterogeneous memory device B220 and a data buffer B230 areomitted. For descriptive convenience, a detailed description aboutabove-described components may be omitted. Referring to FIG. 27, anonvolatile memory module B200 may include the heterogeneous memorydevice B220 and the data buffer B230.

Unlike the heterogeneous memory device 120 of FIG. 2, the heterogeneousmemory device B220 of FIG. 27 may include a plurality of volatilememories B221, an NVM controller B222, and a plurality of nonvolatilememories B223. Each of the volatile memories B221, the NVM controllerB222, and the nonvolatile memories B223 may be implemented with aseparate die, a separate chip, or a separate package. Each of thevolatile memories B221, the NVM controller B222, and the nonvolatilememories B223 may be implemented with a separate chip, and the separatechips may be implemented in one package through a multi-chip package(MCP).

The plurality of volatile memories B221 may be configured to sharedifferent memory data lines MDQ1 to MDQn with the NVM controller B222.For example, the first volatile memory VM1 may share the first memorydata line MDQ1 with the NVM controller B222. The first memory data lineMDQ1 may be connected with the data buffer B230. In example embodiments,the first memory data line MDQ1 may include eight lines. The n-thvolatile memory VMn may share the n-th memory data line MDQn with theNVM controller B222. The n-th memory data line MDQn may be connectedwith the data buffer B230. In example embodiments, the n-th memory dataline MDQn may include eight lines. Each of the plurality of volatilememories B221 may share a corresponding one among the memory data linesMDQ1 to MDQn with the NVM controller B222, and the plurality of memorydata lines MDQ1 to MDQn may be connected with one data buffer B230.

The data buffer B230 may be connected with the processor 101 (refer toFIG. 1) through the data line DQ. In this case, the number of data linesDQ may be determined according to the number of memory data lines MDQ1to MDQn.

In example embodiments, the nonvolatile memory module B200 may operateaccording to an operation method described with reference to FIGS. 1 to8.

FIG. 28 is a block diagram illustrating a nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept. Fordescriptive convenience, a detailed description about elements describedwith reference to FIG. 27 is omitted. Referring to FIG. 28, anonvolatile memory module B300 may include a heterogeneous memory deviceB320 and a data buffer B330. The heterogeneous memory device B320 mayinclude a plurality of volatile memories B321, an NVM controller B322,and a plurality of nonvolatile memories B223.

Unlike the heterogeneous memory device B220 of FIG. 27, theheterogeneous memory device B320 may include a dedicated flush channelFC. The dedicated flush channel FC may provide a data transmission pathbetween each volatile memory B321 and the NVM controller B222. Asdescribed above, the nonvolatile memory module B300 may perform theflush operation. The nonvolatile memory module B300 may control theheterogeneous memory device B320 such that data is provided from eachvolatile memory B321 to the NVM controller B322 through the device flushchannel FC.

In example embodiments, the nonvolatile memory module B300 may operateaccording to an operation method described with reference to FIGS. 1 to8.

FIG. 29 is a block diagram illustrating the nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.Referring to FIG. 29, a nonvolatile memory module B400 may include amodule controller MC, a plurality of heterogeneous memory devices HMD, aplurality of data buffers DB, an SPD, and a tag dedicated volatilememory TVM. In example embodiments, the nonvolatile memory module B400may have the form of load reduced dual in-line memory module (LRDIMM).For descriptive convenience, a duplicated description aboutabove-described elements is omitted.

As described above, the module controller MC may receive a modulecommand/address CA from the processor 101 (refer to FIG. 1) and mayoutput the NVM command/address CA_n and the VM command/address CA_v inresponse to the received module command/address CA. In exampleembodiments, the NVM command/address CA_n and the VM command/addressCA_v may be provided to the heterogeneous memory devices HMD throughdifferent buses.

Each of the plurality of heterogeneous memory devices HMD may beimplemented with a separate package and may be one among heterogeneousmemory devices described with reference to FIGS. 1 to 28. As describedabove, each of the plurality of heterogeneous memory devices HMD mayoperate in response to the NVM command/address CA_n and the VMcommand/address CA_v from the module controller MC. In exampleembodiments, the NVM command/address CA_n may be provided to an NVMcontroller included in each heterogeneous memory device HMD, and the VMcommand/address CA_v may be provided to a volatile memory and the NVMcontroller that are included in the heterogeneous memory device HMD.

The SPD may include the device information DI about the nonvolatilememory module B400 and may provide the device information DI to theprocessor 101.

The tag dedicated volatile memory TVM may operate in response to the VMcommand/address CA_v from the module controller MC. The tag dedicatedvolatile memory TVM may store tags TAG about pieces of data stored involatile memories of the heterogeneous memory devices HMD. The tagdedicated volatile memory TVM may send and receive a tag TAG through thetag data line TDQ. In example embodiments, the tag data line TDQ may beshared by the module controller MC, the plurality of heterogeneousmemory devices HMD, and the tag dedicated volatile memory TVM.

The tag dedicated volatile memory TVM may be configured to be similar tothe heterogeneous memory device HMD. For example, a volatile memoryincluded in at least one among the plurality of heterogeneous memorydevices HMD may be used as the tag dedicated volatile memory TVM.

In example embodiments, the nonvolatile memory module B400 of FIG. 29may operate according to an operation method described with reference toFIGS. 1 to 8.

FIG. 30 is a block diagram illustrating a nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept. Fordescriptive convenience, a detailed description about above-describedcomponents may be omitted. Referring to FIG. 30, a nonvolatile memorymodule B500 may include the module controller MC, a plurality ofvolatile memories VM11 to VM1 n and VM21 to VM2 m, a plurality ofnonvolatile memories NVM11 to NVM1 kand NVM21 to NVM2 i, the tagdedicated volatile memory TVM, the SPD, and the plurality of databuffers DB. In example embodiments, the nonvolatile memory module B500of FIG. 30 may have an LRDIMM structure.

In the plurality of volatile memories VM11 to VM1 n and VM21 to VM2 m,volatile memories VM11 to VM1 n may be configured to share memory datalines MDQ with a first NVM controller B522 a. The remaining volatilememories VM21 to VM2 m may be configured to share memory data lines MDQwith a second NVM controller B522 b. Each of the plurality of volatilememories VM11 to VM1 n and VM21 to VM2 m may be configured to share thememory data line MDQ with a corresponding one among the plurality ofdata buffers DB.

In the plurality of nonvolatile memories NVM11 to NVM1 k and NVM21 toNVM2 i, nonvolatile memories NVM11 to NVM1 k may be configured tooperate in response to control of the first NVM controller B522 a. Theremaining nonvolatile memories NVM21 to NVM2 i may be configured tooperate in response to control of the second NVM controller B522 b.

The tag dedicated volatile memory TVM may be configured to share the tagdata line TDQ with the module controller MC, the first NVM controllerB522 a, and the second NVM controller B522 b.

In example embodiments, each of elements illustrated in FIG. 30 may beimplemented with a semiconductor chip, and at least a part of thesemiconductor chips may be implemented in one package. For example, eachof the plurality of volatile memories VM11 to VM1 n and VM21 to VM2 m,the plurality of nonvolatile memories NVM11 to NVM1 k and NVM21 to NVM2i, the first NVM controller B522 a, and the second NVM controller B522 bmay be implemented with a separate semiconductor chip. A part of theplurality of volatile memories VM11 to VM1 n and VM21 to VM2 m, theplurality of nonvolatile memories NVM11 to NVM1 k and NVM21 to NVM2 i,the first NVM controller B522 a, and the second NVM controller B522 bmay be implemented in one package.

For example, a part (e.g., VM11 to VM1 n) of the plurality of volatilememories VM11 to VM1 n and VM21 to VM2 m may be implemented in onepackage, and the NVM controller B522 a and a part (e.g., NVM11 to NVM1k) of the plurality of nonvolatile memories NVM11 to NVM1 k and NVM21 toNVM2 i may be implemented in another package.

In example embodiments, the tag dedicated volatile memory TVM mayinclude a plurality of semiconductor chips. For example, the tagdedicated volatile memory TVM may include a plurality of tag dedicatedvolatile memory chips, each of which stores the same tag, ECC, and dirtyinformation. In this case, even though an operation of any one tagdedicated volatile memory chip is abnormal, it may be possible to writeor output normally tag information, ECC information, and dirtyinformation through another tag dedicated volatile memory. In exampleembodiments, a package in which the tag dedicated volatile memory TVM isincluded may be different from a package in which other elements areincluded. Alternatively, the tag dedicated volatile memory TVM may beimplemented with a package in which at least a part of other elements isincluded.

In example embodiments, the nonvolatile memory module B500 of FIG. 30may operate according to an operation method described with reference toFIGS. 1 to 8.

FIG. 31 is a block diagram illustrating a nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.Referring to FIG. 31, a nonvolatile memory module B600 may include themodule controller MC, a plurality of volatile memories VM, an NVMcontroller B622, a plurality of nonvolatile memories NVM, one or moretag dedicated volatile memories TVM, the SPD, and the plurality of databuffers DB. For descriptive convenience, a detailed description aboutabove-described components may be omitted. In example embodiments, thenonvolatile memory module B600 of FIG. 31 may have an LRDIMM structure.

Unlike the nonvolatile memory module B500 of FIG. 30, the nonvolatilememory module B600 of FIG. 31 may control the nonvolatile memories NVMthrough one NVM controller B622. That is, each of the plurality ofvolatile memories VM may be configured to share a memory data line MDQwith the NVM controller B622.

The tag dedicated volatile memory TVM may be configured to share the tagdata line TDQ with the module controller MC and the NVM controller B622.As described above, on the basis of the VM command/address CA_v, the tagdescribed volatile memory TVM may write a tag TAG or may output a tagTAG stored therein.

In example embodiments, the nonvolatile memory module B600 of FIG. 31may operate according to an operation method described with reference toFIGS. 1 to 8.

FIG. 32 is a block diagram illustrating the nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.Referring to FIG. 32, a nonvolatile memory module B700 may include themodule controller MC, first and second NVM controllers B722 a and B722b, the plurality of volatile memories VM11 to VM1 n and VM21 to VM2 m, aplurality of nonvolatile memories NVM11 to NVM1 k and NVM21 to NVM2 i,the one or more tag dedicated volatile memories TVM, the SPD, theplurality of data buffers DB, and a tag control circuit TC. Fordescriptive convenience, a detailed description about above-describedcomponents may be omitted. In example embodiments, the nonvolatilememory module B700 of FIG. 32 may have an LRDIMM structure.

Unlike the nonvolatile memory modules B400 to B600 of FIGS. 29 to 31,the nonvolatile memory module B700 of FIG. 32 may further include thetag control circuit TC. The control circuit TC may be configured toshare the tag data line TDQ with the tag dedicated volatile memory TVM.That is, the tag control circuit TC may receive a tag TAG from the tagdedicated volatile memory TVM through the tag data line TDQ or may sendthe tag TAG to the tag dedicated volatile memory TVM through the tagdata line TDQ.

The module controller MC may control the tag control circuit TC todetermine whether a cache hit or a cache miss occurs, and the tagcontrol circuit TC may output cache information INFO as thedetermination result. For example, the tag control circuit TC mayreceive the tag TAG from the tag dedicated volatile memory TVM undercontrol of the module controller MC. The tag control circuit TC maycompare a tag TAG (or an address ADD) from the module controller MC anda tag TAG from the tag dedicated volatile memory TVM and to determinewhether a cache miss or a cache hit occurs.

In example embodiments, the tag control circuit TC may be implementedwith software or hardware, and the tag control circuit TC may beincluded in the module controller MC or may be included in each of thefirst and second NVM controllers B722 a and B722 b.

In example embodiments, the nonvolatile memory module B700 of FIG. 32may operate according to an operation method described with reference toFIGS. 1 to 8.

FIG. 33 is a block diagram illustrating a nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.Referring to FIG. 33, a nonvolatile memory module B800 may include themodule controller MC, the plurality of heterogeneous memory devices HMD,the tag dedicated volatile memory TVM, and the SPD. For descriptiveconvenience, a detailed description about above-described components maybe omitted.

Unlike the nonvolatile memory module B400 of FIG. 29, the nonvolatilememory module B800 illustrated in FIG. 33 may not include a plurality ofdata buffers. That is, the nonvolatile memory module B800 may have aregistered DIMM (RDIMM) structure.

Each of the plurality of heterogeneous memory devices HMD may bedirectly connected with the data line DQ. In example embodiments, an NVMcontroller and a volatile memory included in each of the plurality ofheterogeneous memory devices HMD may be configured to share the dataline DQ.

In example embodiments, the processor 101 (refer to FIG. 1) may receivethe device information DI from the SPD of the nonvolatile memory moduleB800 and may control the nonvolatile memory module B800 based on thereceived device information DI. In this case, the device information DImay include operation information of the nonvolatile memory module B800such as a read latency RL and a write latency WL. That is, even though avolatile memory and an NVM controller included in each heterogeneousmemory device HMD share a data line DQ and exchange data with each otherthrough the data line DQ independent of a request of the processor 101,because the processor 101 controls the nonvolatile memory module B800based on the device information, the processor 101 may perform normallya read or write operation about the nonvolatile memory module B800.

In example embodiments, the nonvolatile memory module B800 of FIG. 33may operate according to an operation method described with reference toFIGS. 1 to 8.

FIG. 34 is a block diagram illustrating the nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.Referring to FIG. 34, a nonvolatile memory module B900 may include themodule controller MC, the plurality of volatile memories VM11 to VM1 nand VM21 to VM2 m, first and second NVM controllers B922 a and B922 b,the plurality of nonvolatile memories NVM11 to NVM1 k and NVM21 to NVM2i, the one or more tag dedicated volatile memories TVM, and the SPD. Fordescriptive convenience, a detailed description about above-describedcomponents may be omitted.

Unlike the nonvolatile memory module B 500 of FIG. 30, the nonvolatilememory module B900 of FIG. 34 may not include the plurality of databuffers DB. That is, the nonvolatile memory module B900 may have anRDIMM structure. In this case, a part (e.g., VM11 to VM1 n) of theplurality of volatile memories VM11 to VM1 n and VM21 to VM2 m may sharethe data line DQ with the first NVM controller B922 a, and the others(e.g., VM21 to VM2 m) may share the data line DQ with the second NVMcontroller B922 b.

As in a description given with reference to FIG. 33, even though thedata lines DQ are shared by the plurality of volatile memories VM11 toVM11 n and VM21 to VM2 m and the first and second NVM controllers B922 aand B922 b, because the processor 101 operates based on the deviceinformation DI from the SPD, the processor 101 may control normally thenonvolatile memory module regardless of data exchange between thevolatile memories VM11 to VM11 n and VM21 to VM2 m and the first andsecond NVM controllers B922 a and B922 b.

In example embodiments, the nonvolatile memory module B900 of FIG. 34may operate according to an operation method described with reference toFIGS. 1 to 27.

FIG. 35 is a block diagram illustrating the nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.Referring to FIG. 35, a nonvolatile memory module BA00 may include themodule controller MC, a plurality of volatile memories VM, an NVMcontroller BA22, nonvolatile memories NVM, the one or more tag dedicatedvolatile memories TVM, and the SPD. For descriptive convenience, adetailed description about above-described components may be omitted.

Unlike the nonvolatile memory module B600 of FIG. 31, the nonvolatilememory module BA00 of FIG. 35 may not include the plurality of databuffers DB. That is, the nonvolatile memory module A00 may have an RDIMMstructure. The plurality of volatile memories VM may be configured toshare data lines DQ with the NVM controller BA22.

As described above, because the processor 101 operates based on thedevice information DI from the SPD, the processor 101 may controlnormally the nonvolatile memory module BA00 regardless of data exchangebetween the plurality of volatile memories VM and the NVM controllerBA22.

The above-described example embodiments may be examples, not limitedthereto. Nonvolatile memory modules according to example embodiments ofthe inventive concept may be variously modified or changed.

FIG. 36 is a drawing for describing, in detail, a tag of FIG. 9.Referring to FIGS. 1, 2, and 36, an address ADD provided from theprocessor 101 may include a row address and a column address. The rowaddress may include a plurality of row bits R1 to Ri, and the columnaddress may include a plurality of column bits C1 to Ck. In exampleembodiments, at least one among the plurality of cache lines may beselected according to the plurality of row bits R1 to Ri and theplurality of column bits C1 to Ck.

In example embodiments, the tag TAG may include at least a part of theplurality of row bits R1 to Ri. For example, the tag TAG may includefirst to fourth row bits R1 to R4. In this case, the remaining row bitsR5 to Ri and the column bits C1 to Ck may constitute an address ADD_vmof the volatile memory 121. That is, at least one among the plurality ofcache lines in the volatile memory 121 may be selected according to theremaining row bits R5 to Ri and the column bits C1 to Ck. In exampleembodiments, the tag TAG may include a part of uppermost bits of theplurality of row bits in the row address.

In example embodiments, a configuration of an address according toexample embodiments of the inventive concept may not be limited to theaddress ADD illustrated in FIG. 36. For example, the address ADD fromthe processor 101 may further include a chip address, a bank address, arow address, or a column address. Alternatively, the address ADD fromthe processor 101 may be changed to have various address formats.

Furthermore, a configuration of the tag TAG according to exampleembodiments of the inventive concept may not be limited to the tag TAGillustrated in FIG. 36. The tag TAG may include at least a part of theaddress ADD. In this case, at least a part of the address ADD mayinclude a part of the plurality of row bits R1 to Ri, a part of theplurality of column bits C1 to Ck, or a combination thereof.

Furthermore, address bits included in tag TAG according to exampleembodiments of the inventive concept may have given bit place values.For example, the tag TAG may include n uppermost bits of the addressADD. In this case, the n uppermost bits may be given bit place values.Furthermore, address bits included in the tag TAG may be changed by themodule controller 110, the tag control circuit TC, or the NVM controller122.

FIG. 37 is a drawing for describing a tag managing method of thenonvolatile memory module of FIG. 2. In example embodiments, anonvolatile memory module C100 of FIG. 37 may be a device or module thatis substantially the same as or similar to the nonvolatile memory module100 of FIGS. 1 and 2. For descriptive convenience, a detaileddescription about elements, which are unnecessary to describe the tagmanaging method, and the above-described elements is omitted.Furthermore, for descriptive convenience, it is assumed that thenonvolatile memory module C100 receives a module read command and firstaddress (RD/ADD1) from the processor 101 and operates in response to thereceived signal. In addition, at least a part of the first address ADD1is assumed as corresponding to a first entry ET1 of a volatile memoryC121. That is, the volatile memory C121 may select or activate the firstentry ET1 in response to the first address ADD1.

Referring to FIGS. 1 and 37, the nonvolatile memory module C100 mayinclude a module controller C110, the volatile memory C121, an NVMcontroller C122, a nonvolatile memory C123, and a data buffer C130.Because the module controller C110, the volatile memory C121, the NVMcontroller C122, the nonvolatile memory C123, and the data buffer C130are above described, a detailed description thereof is thus omitted.

The module controller C110 may receive a module read command and firstaddress (RD/ADD1) from the processor 101 and may provide a VM readcommand and first address (RD_v/ADD1) to the volatile memory C121 and anNVM read command and first address (RD_n/ADD1) to the NVM controllerA121 in response to the received signal.

On the basis of the VM read command and first address (RD_v/ADD1), thevolatile memory C121 may select the first entry ET1 and may output dataDT_v and a tag TAG_v that are stored in the first entry ET1. In thiscase, the tag TAG_v may be output through the tag data line TDQ that isshared by the volatile memory C121, the NVM controller C122, and themodule controller C110, and the data DT_v may be output through thememory data line MDQ that is shared by the volatile memory C121 and theNVM controller C122.

In example embodiments, the module controller C110 may include the tagcontrol circuit TC. The tag control circuit TC may be connected with thetag data line TDQ. The tag control circuit TC may receive a tag TAG fromthe volatile memory C121 through the tag data line TDQ and may comparethe received tag TAG with the address ADD. The tag control circuit TCmay output cache information INFO about a cache hit H or a cache miss Mto the processor 101 based on the comparison result.

For example, as described above, the tag TAG may include at least a partof an address corresponding to the tag TAG. The tag control circuit TCmay compare an address (e.g., the first address ADD1) received from theprocessor 101 and the tag TAG received from the volatile memory C121.When at least a part of the first address ADD1 is the same as the tagTAG, the control circuit TC may output the cache information INFO aboutthe cache hit H. In contrast, when at least a part of the first addressADD1 is not the same as the tag TAG, the control circuit TC may outputthe cache information INFO about the cache miss M.

In example embodiments, the NVM controller C122 may receive the tag TAGthrough the tag data line TDQ and may perform an operation, such as aread caching operation or a data flush operation, based on the receivedtag TAG.

FIG. 38 is a drawing for describing a tag managing method of thenonvolatile memory module of FIG. 2. Referring to FIGS. 1 and 38, thenonvolatile memory module C100 may include the module controller C110,the volatile memory C121, the NVM controller C122, the nonvolatilememory C123, and the data buffer C130. For descriptive convenience, adetailed description about above-described components may be omitted.

The module controller C110 may receive a module write command and firstaddress (WR/ADD1) from the processor 101 and may provide a VM writecommand and first address (WR_v/ADD1) to the volatile memory C121 and anNVM write command and first address (WR_(n/)ADD1) to the NVM controllerC121 in response to the received signal.

In example embodiments, the module controller C110 may provide thevolatile memory 121 with a VM read command and first address (RD_v/ADD1)in response to the module write command and first address (WR/ADD1). Forease of illustration, a configuration that is the same as that describedabove is omitted.

The volatile memory C121 may select the first entry ET1 in response tothe VM write command and first address (WR_v/ADD1). In exampleembodiments, the first entry ET1 may indicate a storage area of thevolatile memory C121 corresponding to at least a part of the firstaddress ADD1.

The data buffer C130 may provide write data DT_v from the processor 101to the volatile memory C121 and the NVM controller C122 through thememory data line MDQ. The volatile memory C121 may write the write dataDT_w received through the memory data line MDQ in the first entry ET1that is selected by at least a part of the first address ADD1. In thiscase, the volatile memory C121 may write the write tag TAG_w receivedthrough the tag data line TDQ in the first entry ET1 together with thewrite data DT_w.

In example embodiments, the write tag TAG_w may be a tag that isgenerated by the tag control circuit TC of the module controller C110.For example, the tag control circuit TC may select at least a part offirst address ADD1 received from the processor 101 as the write tagTAG_w. That is, the write tag TAG_w may correspond to write data DT_w tobe written in the volatile memory C121.

The tag control circuit TC may provide the write tag TAG_w to thevolatile memory C121 by driving a voltage of the tag data line TDQ basedon the selected write tag TAG_w.

As described above, during a write operation, the nonvolatile memorymodule C100 may write the write tag TAG_w and the write data DT_wtogether in the same entry of the plurality of entries in the volatilememory C121 so that an operation of determining whether a cache hit or acache miss occurs is performed normally.

FIG. 39 is a timing diagram for describing a tag sending method of thenonvolatile memory modules of FIGS. 37 and 38. Referring to FIGS. 37 to39, an X-axis of FIG. 39 represents a time.

As illustrated in a first section of FIG. 39, a tag TAG_v stored in thevolatile memory C121 may be output from the volatile memory C121 throughthe tag data line TDQ. In this case, the tag TAG_v may be output insynchronization with a tag data strobe line TDQS. A signal of the tagdata strobe line TDQS may be driven by the tag control circuit TC or thevolatile memory C121.

Likewise, as illustrated in a second section of FIG. 39, a write tagTAG_w may be output through the tag data line TDQ. In this case, thewrite tag TAG_w may be output in synchronization with the tag datastrobe line TDQS. A signal of the tag data strobe line TDQS may bedriven by the tag control circuit TC or the volatile memory C121.

As described above, the tag TAG_v may be sent and received through thetag data line TDQ in synchronization with a signal of the tag datastrobe line TDQS. In example embodiments, the tag data strobe line TDQSmay be a signal line that is different from a data strobe line DQSbetween the processor 101 and the nonvolatile memory module C100 or amemory data strobe line MDQS in the nonvolatile memory module C100. Thetag data strobe line TDQS may be a signal line of which the frequency isthe same as that of the data strobe line DQS between the processor 101and the nonvolatile memory module C100 or that of the memory data strobeline MDQS in the nonvolatile memory module C100.

FIG. 40 is a block diagram illustrating a nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.Referring to FIGS. 1 and 40, a nonvolatile memory module C200 mayinclude a module controller C210, first and second volatile memoriesC221_1 and C221_2, an NVM controller C222, a nonvolatile memory C223,and a data buffer C230. For descriptive convenience, a detaileddescription about above-described components may be omitted.

The nonvolatile memory module C200 of FIG. 40 may further include thesecond volatile memory C221_2 as a tag dedicated volatile memory. As thetag dedicated volatile memory, the second volatile memory C221_2 may beconfigured to store a tag TAG_v about data DT_v stored in the sameentry. For example, the first and second volatile memories C221_1 andC221_2 may select a first entry ET1 in response to a VM command/addressCA_v from the module controller C210. The first entry ET1 may include apart of each of the first and second volatile memories C221_1 andC221_2.

The first entry ET1 of the first volatile memory C221_1 may include thedata DT_v. The first volatile memory C221_1 may send and receive thedata DT_v through the memory data line MDQ. The first entry ET1 of thesecond volatile memory C221_2 may include the tag TAG_v. The secondvolatile memory C221_2 may send and receive the tag TAG_v through thetag data line TDQ.

In example embodiments, each of the first and second volatile memoriesC221_1 and C221_2 may be implemented with a separate die, a separatechip, or a separate package.

That is, the nonvolatile memory module C200 may include a tag dedicatedvolatile memory for storing the tag TAG, and the tag dedicated volatilememory may be implemented with a separate chip independently of avolatile memory for storing data. In this case, the tag dedicatedvolatile memory may operate in response to the VM command/address CA_vfrom the module controller MC like other volatile memories.

FIG. 41 is a block diagram illustrating a nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.Referring to FIGS. 1 and 41, a nonvolatile memory module C300 mayinclude a module controller C310, first to third volatile memoriesC321_1 to C321_3, an NVM controller C322, a nonvolatile memory C323, anda data buffer C330. For descriptive convenience, a detailed descriptionabout above-described components may be omitted.

Unlike the nonvolatile memory module C200 of FIG. 40, the nonvolatilememory module C300 of FIG. 41 may further include the third volatilememory C221_3 as a tag dedicated volatile memory. That is, thenonvolatile memory module C300 may include at least two tag dedicatedvolatile memories.

As the tag dedicated volatile memory, each of the second and thirdvolatile memories C321_2 and C321_3 may be configured to store a tagTAG_v corresponding data DT_v stored in the first volatile memoryC321_1. For example, each of the first to third volatile memories C321_1and C321_3 may operate in response to a VM command/address CA_v from themodule controller C310. On the basis of the VM command/address CA_v fromthe module controller C310, each of the first to third volatile memoriesC321_1 and C321_3 may select a first entry ET1 corresponding to at leasta part of a first address ADD1 and may access the first entry ET1 thusselected.

In example embodiments, the first entry ET1 may include the data DT_v ofthe first volatile memory C321_1, the tag TAG_v of the second volatilememory C321_2, and the tag TAG_v of the third volatile memory C321_3.The tag TAG_v of the second volatile memory C321_2 may be provided tothe NVM controller C322 and the module controller C310 through a firsttag data line TDQ1, and the tag TAG_v of the third volatile memoryC321_3 may be provided to the NVM controller C322 and the modulecontroller C310 through a second tag data line TDQ 2.

Alternatively, the second volatile memory C321_2 may receive the writetag TAG_w (refer to FIG. 38) through the first tag data line TDQ1 andmay write the write tag TAG_w in the first entry ET1; the third volatilememory C321_3 may receive the write tag TAG_w (refer to FIG. 38) throughthe second tag data line TDQ2 and may write the write tag TAG_w in thefirst entry ET1. That is, the nonvolatile memory module C300 may includeat least two tag dedicated volatile memories. Each of the at least twotag dedicated volatile memories may be implemented with a separate die,a separate chip, or a separate package.

In example embodiments, the tag dedicated volatile memory may not belimited to the second and third volatile memories C321 2 and C321 3. Thenonvolatile memory module C300 may include at least two or more tagdedicated volatile memories, each of which is implemented with aseparate die, a separate chip, or a separate package.

In example embodiments, a value of the tag TAG_v written in the firstentry ET1 of the second volatile memory C321_2 may be the same as thatof the tag TAG_v written in the first entry ET1 of the third volatilememory C321_3. That is, even though one among the second and thirdvolatile memories C321_2 and C321_3 as tag dedicated volatile memoriesdoes not operate normally due to a factor (i.e., at a chip-killsituation), the other that operates normally may send and receive thetag TAG, thereby making it possible for the nonvolatile memory moduleC300 to operate normally.

FIG. 42 is a block diagram illustrating the nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.Referring to FIG. 42, a nonvolatile memory module C400 may include amodule controller C410, a volatile memory C421, an NVM controller C422,a nonvolatile memory C423, a data buffer C430, and the tag controlcircuit TC. For descriptive convenience, a detailed description aboutabove-described components may be omitted.

The nonvolatile memory module C400 of FIG. 42 may include the tagcontrol circuit TC separately. As described above, the tag controlcircuit TC may receive a tag TAG through the tag data line TDQ or maysend the tag TAG to the volatile memory C421 through the tag data lineTDQ. For example, the tag control circuit TC may be disposed outside themodule controller C410 and may generate the write tag TAG_w based on afirst address ADD1 that is received from the module controller C410(i.e., an address provided from the processor 101). Alternatively, thetag control circuit TC may compare the tag TAG_v received through thetag data line TDQ and the address ADD1 and may output cache informationINFO about a cache hit or cache miss based on the comparison result.

In example embodiments, a configuration of the nonvolatile memory moduleaccording to example embodiments may not be limited to theabove-described example embodiments. For example, the nonvolatile memorymodule according to example embodiments may include at least one tagdedicated volatile memory, which is configured to share the tag dataline TDQ with a separate tag control circuit.

FIG. 43 is a flowchart illustrating an operation method of thenonvolatile memory module of FIG. 2. In example embodiments, operationsof FIG. 43 may be performed by the tag control circuit TC of thenonvolatile memory module. As described above, the tag control circuitTC may be included in a module controller, or the tag control circuit TCmay be disposed as a separate chip outside the module controller or maybe included in an NVM controller. For descriptive convenience, it isassumed that the tag control circuit TC is included in the modulecontroller. However, example embodiments of the inventive concept maynot be limited thereto.

Referring to FIGS. 2, 37, and 43, in step CS110, the nonvolatile memorymodule C110 may receive an address ADD from the processor 101. Inexample embodiments, the module controller C110 may receive a modulecommand/address CA from an external device. The module command/addressCA may include an address ADD corresponding to data or an area to beaccessed.

In step CS120, the module controller C110 may set a part of the receivedaddress ADD as a tag TAG. For example, as described with reference toFIG. 36, the address ADD may include a plurality of bits R1 to Ri and C1to Ck, and a part of the plurality of bits may be set as the tag TAG.That is, the tag TAG may include a part of the address ADD.

In example embodiments, as described above, the part of the address ADDset as the tag TAG may have given bit place values. Alternatively, theset part of the address ADD may be changed by the tag control circuitTC.

In step CS130, the module controller C110 may drive a voltage of the tagdata line TDQ based on the set tag TAG.

In example embodiments, the volatile memory C121 may receive the tag TAGby sensing a voltage of the tag data line TDQ and may write the receivedtag in an entry corresponding to at least a part of the address ADD.

FIG. 44 is a flowchart illustrating an operation method of thenonvolatile memory module of FIG. 2, according to example embodiments ofthe inventive concept. In example embodiments, operations of FIG. 44 maybe performed by the tag control circuit TC of the nonvolatile memorymodule. As described above, the tag control circuit TC may be includedin a module controller, or the tag control circuit TC may be disposed asa separate chip outside the module controller or may be included in anNVM controller. For descriptive convenience, it is assumed that the tagcontrol circuit TC is included in the module controller. However,example embodiments of the inventive concept may not be limited thereto.

Referring to FIGS. 2, 37, and 44, in step CS210, the module controllerC110 may receive an address ADD from the processor 101.

In step CS220, the module controller C110 may receive a tag TAG throughthe tag data line TDQ. For example, the module controller C110 mayreceive the tag TAG through the tag data line TDQ from a volatile memoryor a tag dedicated volatile memory.

In step CS230, the module controller C110 may compare a part of thereceived address ADD and the tag TAG and may determine whether a cachemiss occurs, based on the comparison result. For example, as describedabove, in the case in which the part of the received address ADD is thesame as the tag TAG, the module controller C110 may determine the caseas a cache hit. In the case in which the part of the received addressADD is not the same as the tag TAG, the module controller C110 maydetermine the case as a cache miss.

In step CS240, the module controller C110 may output cache informationINFO based on the determination result. For example, the modulecontroller C110 may output information about the cache miss or the cachehit as the cache information INFO, based on the determination result.

FIG. 45 is a block diagram illustrating the nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.Referring to FIG. 45, a nonvolatile memory module C500 may include themodule controller MC, the plurality of heterogeneous memory memoriesHMD, the plurality of data buffers DB, and the SPD. For descriptiveconvenience, a detailed description about above-described components maybe omitted. In example embodiments, the memory module C500 illustratedin FIG. 45 may have an LRDIMM structure.

The module controller MC may receive a module command/address CA fromthe processor 101 and may provide each of the heterogeneous memorydevices HDM with a VM command/address CA_v and an NVM command/addressCA_n in response to the received signal.

Each of the plurality of heterogeneous memory devices HMD may be aheterogeneous memory device that includes volatile memories, NVMcontrollers, and nonvolatile memories described with reference to FIGS.36 to 42. For example, the plurality of heterogeneous memory devices HMDmay be connected with the plurality of data buffers DB through thememory data lines MDQ, respectively, and may share the tag data lineTDQ. That is, each of the plurality of heterogeneous memory devices HMDmay store a tag or data and may send and receive the tag or data throughthe tag data line TDQ and the memory data line MDQ under control of themodule controller MC.

In example embodiments, each of the plurality of heterogeneous memorydevices HMD may operate according to an operation method described withreference to FIGS. 1 to 44.

FIG. 46 is a block diagram illustrating a nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.Referring to FIG. 46, a nonvolatile memory module C600 may include themodule controller MC, the plurality of heterogeneous memory devices HMD,a tag dedicated heterogeneous memory device TAG HMD, the plurality ofdata buffers DB, and the SPD. For descriptive convenience, a detaileddescription about above-described components may be omitted. In exampleembodiments, the nonvolatile memory module C600 of FIG. 46 may have anLRDIMM structure.

Unlike the nonvolatile memory module C500 of FIG. 45, the nonvolatilememory module C600 of FIG. 46 may include the tag dedicated memorydevice TAG HMD. Each of the plurality of heterogeneous memory devicesHMD may be configured to store data DT_v and may not be connected withthe tag data line TDQ. The tag dedicated memory device TAG HMD may bevolatile memories, NVM controllers, and nonvolatile memories describedwith reference to FIGS. 37 to 44. That is, the tag dedicated memorydevice TAG HMD may be configured to store and output a corresponding tagTAG based on a VM command/address CA_v of the module controller MC. Inthis case, the tag dedicated memory device TAG HMD may be configured toshare the tag data line TDQ with the module controller MC.

FIG. 47 is a flowchart illustrating an operation of the NVM controllerof the nonvolatile memory module of FIG. 2. For descriptive convenience,a detailed description about above-described components and an operationmethod is omitted. In example embodiments, the operation methodaccording to the flowchart of FIG. 47 shows a flush operation that willbe performed during a write operation about the nonvolatile memorymodule 100.

Referring to FIGS. 2 and 47, in step DS110, the NVM controller 122 mayoutput a tag TAG through the tag data line TDQ. For example, asdescribed with reference to FIGS. 3 and 4, the module controller 110 mayreceive a module write command and first address (WR/ADD1) from theprocessor 101 and may send a VM read command and first address(RD_v/ADD1) in response to the received signal. The volatile memory 121may output data DT_v and a tag TAG_v, which are stored in an entrycorresponding to the first address ADD1 (or a part of the first addressADD1), in response to the VM read command and first address (RD_v/ADD1).Because the tag data line TDQ is shared by the volatile memory 121 andthe NVM controller 122, the NVM controller 122 may receive the tag TAGfrom the volatile memory 121 through the tag data line TDQ.

In step DS120, the NVM controller 122 may determine whether a cache hitor a cache miss occurs, based on the received tag TAG. For example, asdescribed above, the tag TAG may include at least a part of the addressADD corresponding to data stored in the volatile memory 121. That is,the NVM controller A122 may compare the address ADD received from themodule controller 110 and the tag TAG received through the tag data lineTDQ and may determine whether a cache miss or a cache hit occurs, basedon the comparison result.

When the determination result indicates the cache hit, the NVMcontroller 122 may not perform an operation separately.

When the determination result indicates the cache miss, in step DS130,the NVM controller 122 may fetch data DT_v on the memory data line MDQ.For example, as described above, when receiving the VM read command andfirst address (RD_v/ADD1), the volatile memory 121 may control a voltageof the memory data line MDQ based on the data DT_v. Because the memorydata line MDQ is shared by the volatile memory 121 and the NVMcontroller 122, the NVM controller 122 may receive fetch the data DT_von the memory data line MDQ.

In step DS140, the NVM controller 122 may program the fetched data DT_vin the nonvolatile memory 123. In example embodiments, the NVMcontroller 122 may store the fetched data DT_v in a separate buffercircuit, and when the size of the fetched data is greater than or equalto a size, the NVM controller 122 may program the fetched data in thenonvolatile memory 123.

In example embodiments, in the operation method illustrated in FIG. 47,operations of steps DS110 to DS130 may be performed in parallel. Forexample, the NVM controller 122 may simultaneously receive the tag TAGand the data DT_v through the tag data line TDQ and the memory data lineMDQ, respectively, and may determine whether a cache hit or a cache missoccurs, based on the received tag TAG. When the determination resultindicates the cache miss, the NVM con 122 may program the received dataDT_v in the nonvolatile memory 123. When the determination resultindicates the cache hit, the NVM con 122 may invalidate the receiveddata DT_v or may not perform a separate operation about the receiveddata DT_v.

FIG. 48 is a block diagram for describing, in detail, an operationmethod illustrated in FIG. 47. Referring to FIGS. 1, 47, and 48, anonvolatile memory module D100 may include a module controller D110, avolatile memory D121, an NVM controller D122, a nonvolatile memory D123,and a data buffer D130. In example embodiments, the nonvolatile memorymodule D100 of FIG. 48 may be a device or module that is substantiallythe same as or similar to the nonvolatile memory module 100 of FIGS. 1and 2. For descriptive convenience, at least a part of a first addressADD1 provided from the processor 101 is assumed as corresponding to afirst entry ET1 of the volatile memory D121. For descriptiveconvenience, a detailed description about above-described components maybe omitted. In example embodiments, a dotted line illustrated in FIG. 48indicates a flow of a tag TAG_v, dirty information DRT, or data DT_v.

The module controller D110 may receive a module write command and firstaddress (WR/ADD1) from the processor 101 and may provide a VM readcommand and first address (RD_v/ADD1) to the volatile memory D121 and anNVM write command and first address (WR_n/ADD1) to the NVM controllerC121 in response to the received signal.

On the basis of the VM read command and first address (RD_v/ADD1), thevolatile memory D121 may output the data DT_v, the tag TAG_v, and thedirty information DRT that are stored in the first entry ET1. Forexample, the volatile memory D121 may output the data DT_v through thememory data line MDQ and the tag TAG_v and the dirty information DRTthrough the tag data line TDQ, respectively.

Because the NVM controller D122 shares the memory data line MDQ and tagdata line TDQ with the volatile memory D121, the NVM controller D122 mayreceive the data DT_v through the memory data line MDQ and the tag TAG_vand the dirty information DRT through the tag data line TDQ,respectively.

The NVM controller D122 may include a flush manager FM. The flushmanager FM may manage or control the flush operation about data receivedfrom the volatile memory D121. For example, the flush manager FM maydetermine whether a cache miss or a cache hit occurs, based on the tagTAG_v received through the tag data line TDQ and the first address ADDreceived from the module controller D110. When the determination resultindicates the cache miss, the flush manager FM may program the receiveddata DT_v in the nonvolatile memory D123. Alternatively, the flushmanager FM may manage the received data DT_v in a separate buffercircuit, and when the size of data to be flushed is greater than orequal to a size, the flush manager FM may program the data of theseparate buffer circuit in the nonvolatile memory D123.

In example embodiments, the memory data line MDQ that is shared betweenthe volatile memory D121 and the NVM controller D122 may be a flushpath.

In example embodiments, the data buffer may block the data DT_v suchthat the data DT_v on the memory data line MDQ is not sent to theprocessor 101. That is, the processor 101 may not recognize a datatransaction between the volatile memory D121 and the NVM controllerD122.

FIG. 49 is a timing diagram for describing, in detail, the operationmethod of FIGS. 47 and 48. For descriptive convenience, a detaileddescription about above-described elements is omitted. Referring toFIGS. 1 and 48, the module controller D110 may receive a module writecommand and first address (WR/ADD1) from the processor 101.

The module controller D110 may provide an NVM write command and firstaddress (WR_n/ADD1) to the NVM controller D122 and a VM read command andfirst address (RD_v/ADD1) to the volatile memory D122 in response to themodule write command and first address (WR/ADD1). In this case, a pointin time when the NVM write command and first address (WR_v/ADD1) aretransmitted may be different from a point in time when the VM readcommand and first address (RD_v/ADD1) are transmitted. A differencebetween the time when the NVM write command and first address(WR_v/ADD1) are transmitted and the NVM write command and first address(WR_v/ADD1) are transmitted may be denoted as t1.

For example, because an operation characteristic of the volatile memoryD121 is different from that of the nonvolatile memory D123 or the NVMcontroller D122 controlling the nonvolatile memory D123, a time taken toperform a read or write operation about the volatile memory D121 may bedifferent from a time taken to perform a read or write operation aboutthe nonvolatile memory D123 or the NVM controller D122. That is, a time(e.g., a VM read latency) taken to read data DT_v from the volatilememory D121 may be different from a time (e.g., an NVM write latency)taken for the NVM controller D122 to fetch the data DT_v.

In the case in which the NVM write latency is shorter than the VM readlatency, the module controller D110 may send the VM read command andfirst address (RD_v/ADD1) to the volatile memory D121 and may then sendthe NVM write command and first address (WR_(n)/ADD1) to the NVMcontroller D122. Alternatively, in the case in which the NVM writelatency is longer than the VM read latency, the module controller D110may send the NVM write command and first address (WR_n/ADD1) to the NVMcontroller D122 and may then send the VM read command and first address(RD_v/ADD1) to the volatile memory D121.

That is, the module controller D110 may send the VM command/address CA_vand the NVM command/address CA_n to the volatile memory D121 and the NVMcontroller D122 respectively at different points in time that aredetermined according to an operation characteristic of each element,thereby allowing the NVM controller D122 to receive normally data outputfrom the volatile memory D121 through the memory data line MDQ.

FIG. 50 is a flowchart illustrating an operation of the NVM controllerof FIG. 48, according to example embodiments of the inventive concept.Referring to FIGS. 48 and 50, the NVM controller D122 may performoperations of steps DS210 and DS220. Operations of steps DS210 and DS220may be similar to those of steps DS110 and DS120 of FIG. 47, and adetailed description thereof is thus omitted.

If the determination result of step DS220 indicates a cache miss, instep DS230, the NVM controller D122 may determine whether data DT_v fromthe volatile memory D121 is dirty data. For example, after updated withnew data based on a request of the processor 101, the data DT_n storedin the volatile memory D121 may not be flushed into the nonvolatilememory D123. Alternatively, data stored in the nonvolatile memory D123may be different from data of the volatile memory D121 correspondingthereto. In this case, the data of the volatile memory D121 may be dirtydata DRT. The dirty data DRT may include information about a dirty stateabout data stored in the same entry ET. That is, the NVM controller D122may determine a dirty state about the data DT_n of the volatile memoryD121 based on the dirty information DRT received through the tag dataline TDQ.

When the determination result indicates that the data of the volatilememory D121 is not dirty data (i.e., when the data of the volatilememory D121 is clean data), the NVM controller 122 may not perform anoperation separately.

When the determination result of step DS230 indicates that the data ofthe volatile memory D121 is dirty data, the NVM controller 122 mayperform the flush operation to secure integrity of data. For example,the NVM controller D122 may perform operations of steps DS240 and DS250.Operations of steps DS240 and DS250 may be similar to those of stepsDS130 and DS140 of FIG. 47, and a detailed description thereof is thusomitted.

In example embodiments, operations of steps DS210 to DS240 may beperformed in parallel. For example, the NVM controller D122 may receivethe tag TAG and the dirty information DRT through the tag data line TDQand may simultaneously receive the data DT_v through the memory dataline MDQ. At the same time, the NVM controller D122 may determinewhether a cache miss or a cache miss occurs, based on the received tagTAG and may determine whether data of the volatile memory D121 is dirtydata, based on the received dirty information DRT.

In example embodiments, as in the flush operation of the above-describedwrite operation, the flush operation between the volatile memory D121and the NVM controller D222 may be performed during a read operation ofthe nonvolatile memory module D100. For example, as described withreference to FIG. 8, the module controller 110 may receive a module readcommand and first address (RD/ADD1) from the processor 101 and may senda VM read command and first address (RD_v/ADD1) to the volatile memoryD121 in response to the received signal. The volatile memory D121 mayoutput data DT_v and a tag TAG_v in response to the VM read command andfirst address (RD_v/ADD1). In this case, the NVM controller D122 maydetermine whether a cache hit or the cache miss occurs, based on the tagTAG_v. The NVM controller D122 may flush the data DT_v received throughthe memory data line MDQ into the nonvolatile memory D123 based on thedetermination result.

FIG. 51 is a flowchart illustrating an operation of the nonvolatilememory module of FIG. 2, according to example embodiments of theinventive concept. In example embodiments, a flush operation in whichdata is copied or moved from the volatile memory D121 to the nonvolatilememory D123 will be described with reference to FIGS. 47 to 50. Below,there will be described a read caching operation in which data is movedfrom the nonvolatile memory D123 to the volatile memory D121. Fordescriptive convenience, a detailed description about above-describedcomponents may be omitted.

Referring to FIGS. 48 and 51, in step DS310, the nonvolatile memorymodule D100 may output the data DT_n, which is received from thenonvolatile memory D123, through memory the data line MDQ. For example,the NVM controller D122 may read the data DT_n from the nonvolatilememory D123 and may drive a voltage of the memory data line MDQ based onthe read data DT_n.

In step DS320, the nonvolatile memory module D100 may output a tag TAG_nthrough the tag data line TDQ. For example, the module controller D110may generate the tag TAG_n corresponding to the data DT_n based on anaddress ADD provided from the processor 101. The module controller D110may drive a voltage of the tag data line TDQ based on the generated tagTAG.

In step DS330, the nonvolatile memory module D100 may write the tagTAG_n on tag data line TDQ and the data DT_n on the memory data line MDQin an entry corresponding to the address ADD. For example, the volatilememory D121 may receive the tag TAG_n through the tag data line TDQ andmay receive the data DT_n through the memory data line MDQ. The volatilememory D121 may store the received tag TAG_n and the data DT_n in anentry, which corresponds to a part of the address ADD, among a pluralityof entries.

In example embodiments, when a cache miss occurs during a read operationof the nonvolatile memory module D100 and when a read operation about acache-missed address is again performed, there may be performed a readcaching operation described with reference to FIG. 51. Alternatively,the read caching operation described with reference to FIG. 51 may beperformed according to a request of the processor 101.

FIG. 52 is a block diagram for describing, in detail, an operation ofFIG. 51. In example embodiments, a read caching operation when a readoperation about a cache-missed address is again performed will bedescribed with reference to FIG. 51. Referring to FIGS. 1 and 51, thenonvolatile memory module D100 may include the module controller D110,the volatile memory D121, the NVM controller D122, the nonvolatilememory D123, and the data buffer D130. For descriptive convenience, adetailed description about above-described elements is omitted.

As described above, when a cache miss occurs during a read operation ofthe nonvolatile memory module D100, the nonvolatile memory module D100may provide the processor 101 with a ready signal R indicating that dataDT_n of the nonvolatile memory module D123 corresponding to thecache-missed address (e.g., the first address ADD1) is prepared. Theprocessor 101 may provide the nonvolatile memory module D100 with amodule read command and first address (NRD/ADD1) in response to theready signal R. In this case, the module read command NRD may be acommand for reading data DT_n from the nonvolatile memory D123.

The module controller D110 may provide an NVM read command and firstaddress (RD_v′/ADD1) to the NVM controller D122 and a VM write commandand first address (WR_v/ADD1) to the volatile memory D122 in response tothe module read command and first address (NRD/ADD1).

The NVM controller D122 may output the data DT_n, which is received fromthe nonvolatile memory D123, through the memory data line MDQ inresponse to the NVM read command and first address (RD_n′/ADD1). Inexample embodiments, the module controller D110 may output the tag TAG_nthrough the tag data line TDQ in synchronization with timing when thedata DT_n is output through the memory data line MDQ. In exampleembodiments, the tag TAG_n may include at least a part of the firstaddress ADD1.

The volatile memory D121 may write the data DT_n received through thememory data line MDQ and the tag TAG_n received through the tag dataline TDQ in the first entry ET1 corresponding to a part of the firstaddress ADD1 in response to the VM write command and first address(WR_v/ADD1).

In example embodiments, the data buffer D130 may output the data DT_n onthe memory data line MDQ to the processor 101 through the data line DQunder control of the module controller D110.

As described above, because the memory data line MDQ is shared by thevolatile memory D121 and the NVM controller D122, when the data DT_n isoutput from the NVM controller D122, the data DT_n may be written in thevolatile memory D121. That is, the nonvolatile memory module D100 mayperform the read caching operation along a read caching path.

FIG. 53 is a block diagram illustrating a nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept. FIG.54 is a drawing for describing an operation of the cache manager of FIG.53. FIG. 55 is a timing diagram for describing an operation of thenonvolatile memory module of FIG. 53. Referring to FIGS. 1, 53, and 54,a nonvolatile memory module D200 may include a module controller D210, avolatile memory D221, an NVM controller D222, a nonvolatile memory D223,and a data buffer D230. For descriptive convenience, a detaileddescription about above-described components may be omitted.

Unlike the module controller 110 of the nonvolatile memory module 100 ofFIG. 2, the module controller D210 of the nonvolatile memory module D200of FIG. 53 may further include a cache manager CM.

The cache manager CM may manage the volatile memory D221 as a cachememory of the nonvolatile memory D223 effectively. For example, when acache miss occurs during a read operation of the nonvolatile memorymodule D200, the cache manager CM may manage cache-missed addressinformation. Afterwards, when a read operation about the cache-missedaddress is performed, the cache manager CM may control an NVMcommand/address CA_n and a VM command/address CA_v such that datacorresponding to the cache-missed address is output from the nonvolatilememory D223.

In example embodiments, the cache manager CM may assign and managetransaction identifications TID to cache-missed addresses. For example,as illustrated in FIG. 53, the nonvolatile memory module D200 maysequentially perform read operations about first to sixth addresses ADD1to ADD6 in response to a request of the processor 101. A cache miss mayoccur during a read operation about the first address ADD1 In this case,the cache manager CM may assign a first transaction identification TID1to the first address ADD1 cache-missed. Afterwards, a cache hit mayoccur during a read operation about the second address ADD2. In thiscase, the cache manager CM may not perform a separate operation.Afterwards, a cache miss may occur during a read operation about thethird address ADD3. In this case, the cache manager CM may assign asecond transaction identification TID2 to the third address ADD3cache-missed. A cache hit may occur when each of read operations aboutthe fourth and fifth addresses ADD4 and ADD5 is performed; when a cachemiss occurs during a read operation about the sixth address ADD6, thecache manager CM may assign a third transaction identification TID3 tothe sixth address ADD6. Each of the first to third transactionidentifications TID1, TID2, and TID3 may be implemented to be increasedmonotonically.

That is, the cache manager CM may manage cache-missed addresses, andwhenever a cache miss occurs, the cache manager CM may assign a transactidentification TID to the cache-missed address. In this case, thetransaction identification may increase monotonically.

In example embodiments, with regard to cache-missed addresses, thenonvolatile memory module D200 may receive not address information buttransaction identifications TID from the processor 101.

The nonvolatile memory module D200 may receive a module read command andfirst address (RD/ADD1 from the processor 101 and may provide an NVMread command and first address (RD_n/ADD1) to the NVM controller D222and a VM read command and first address (RD_v/ADD1) to the volatilememory D221 in response to the received signal. The volatile memory D221may output first data DT_v1 and a first tag TAG_v1 in response to the VMread command and first address (RD_v/ADD1).

Likewise, the nonvolatile memory module D200 may receive a module readcommand and second address (RD/ADD2) and may provide an NVM read commandand second address (RD_n/ADD2) to the NVM controller D222 and a VM readcommand and second address (RD_v/ADD2) to the volatile memory A221 inresponse to the received signal. The volatile memory D221 may outputsecond data DT_v2 and a second tag TAG_v2 in response to the VM readcommand and second address (RD_v/ADD2).

The first and second data DT_v1 and DT_v2 from the volatile memory D221may not be data corresponding to the first and second addresses ADD1 andADD2. That is, a cache miss may occur during read operations about thefirst and second addresses ADD1 and ADD2. In this case, the cachemanager CM may assign a first transaction identification TID1 and asecond transaction identification TID2 to the first address ADD1 and thesecond address ADD2, respectively.

As described above, the NVM controller D222 may receive the first andsecond tags Tag TAG_v1 and TAG_v2 and may recognize that a cache missoccurs, based on the first and second tags Tag TAG_v1 and TAG_v2. Inthis case, the NVM controller D222 may prepare data corresponding to thefirst and second addresses ADD1 and ADD2 from the nonvolatile memoryD223.

In example embodiments, when the NVM controller A22 prepares data DT_n1corresponding to the first address ADD1 firstly, the nonvolatile memorymodule D200 may provide the ready signal R to the processor 101. Theprocessor 101 may provide the nonvolatile memory module D200 with astatus read command RD_STS in response to the ready signal R.

The nonvolatile memory module D200 may send status information about atransaction identification TID to the processor 101 through a memorydata line MDQ and a data signal DQ in response to the status readcommand RD_STS. In example embodiments, the status read command RD_STSmay be a command that is previously defined to read an area, a statusregister, or a multi-purpose register of the nonvolatile memory moduleD200. In example embodiments, the status information about thetransaction identification TID may be stored in the area, statusregister, or multi-purpose register of the nonvolatile memory moduleD200. In example embodiments, the status information about thetransaction identification TID may be implemented in the form of bitmap.

In example embodiments, the nonvolatile memory module D200 may sendinformation about complete preparation of the first transactionidentification TID1 as status information about a transactionidentification TID. The processor 101 may provide the nonvolatile memorymodule D200 with a module read command and first transactionidentification (RD/TID1) in response to the received status information.

Responsive to the module read command and first transactionidentification (RD/TID1), the nonvolatile memory module D200 may controlthe NVM command/address CA_n and the VM command/address CA_v such thatdata DT_n1 corresponding to the first transaction identification TID1 isoutput from the nonvolatile memory D223.

For example, the cache manager CM may provide an NVM read command andfirst address (RD_n′/ADD1) to the NVM controller D222 and a VM writecommand and first address (WR_v/ADD1) to the volatile memory D221 inresponse to the module read command and first transaction identification(RD/TID1). That is, the cache manager CM may receive the transactionidentification TID from the processor 101. The cache manager CM mayconvert the transaction identification TID into a corresponding addressADD and may provide the address ADD to the volatile memory D221 and theNVM controller D222.

Each of the volatile memory D221 and the NVM controller D222 may performthe above-described read caching operation in response to the receivedsignals.

FIG. 56 is a flowchart illustrating an operation of the nonvolatilememory module of FIG. 2, according to example embodiments of theinventive concept. For descriptive convenience, a detailed descriptionabout above-described components may be omitted. Referring to FIGS. 1,2, 48, and 56, in step DS410, the nonvolatile memory module D100 mayreceive a module read command and address (RD/ADD) from the processor101.

In step DS420, the nonvolatile memory module D100 may determine whethera cache hit or a cache miss occurs. For example, as described above, thenonvolatile memory module D100 may determine whether a cache hit or acache miss occurs, based on a tag stored in an entry, which correspondsto a part of the address ADD, among a plurality of entries of thevolatile memory D121.

If the determination result indicates that the cache hit occurs, in stepDS430, the nonvolatile memory module D100 may output data DT_v of thevolatile memory D121 and cache information INFO indicating the cachehit.

If the determination result indicates that the cache miss occurs, instep DS440, the nonvolatile memory module D100 may output data DT_v ofthe volatile memory D121 and cache information INFO indicating the cachemiss.

In step DS450, the nonvolatile memory module D100 may receive a moduleread command and address (NCRD/ADD) from the processor 101. In exampleembodiments, the module read command NCRD may be a command for readingdata DT_n from the nonvolatile memory D123 without performing the readcaching operation. For example, an access frequency of datacorresponding to a cache-missed address ADD may be low, or the datacorresponding to the cache-missed address may be accessed once. In thiscase, the processor 101 may provide the module read command NCRD,thereby preventing an unnecessary read caching operation.

In example embodiments, each of the above-described module read commandsRD, NRD, and NCRD may be signals or a command that is defined accordingto a communication protocol between the processor 101 and thenonvolatile memory module D100.

In step DS460, the nonvolatile memory module D100 may output data DT_nfrom the nonvolatile memory 123 to the processor 101 without a readcaching operation.

FIG. 57 is a timing diagram for describing, in detail, the operation ofFIG. 56. Referring to FIGS. 1, 2, 48, and 57, the module controller D110may receive a module read command and first address (RD/ADD1) from theprocessor 101. An operation that the nonvolatile memory module D121performs in response to the module read command and first address(RD/ADD1) is described with reference to FIG. 8, and a detaileddescription thereof is thus omitted.

A cache miss may occur during a read operation about the module readcommand and first address (RD/ADD1). In this case, after data DT_ncorresponding to the first address ADD1 is prepared by the NVMcontroller D122, the module controller D110 may provide the ready signalR to the processor 101.

The processor 101 may provide the module read command and first address(NRD/ADD1) to the module controller D110 in response to the ready signalR. In example embodiments, the module read command NRD may be a commandfor reading data DT_n from the nonvolatile memory D123 withoutperforming the read caching operation as described above.

The module controller D110 may provide an NVM read command and firstaddress (RD_n′/ADD1) to the NVM controller D122 in response to themodule read command and first address (NCRD/ADD1), and the NVMcontroller D122 may output the data DT_n in response to the receivedsignal.

In example embodiments, because the module read command NCRD is acommand for reading the data DT_n from the nonvolatile memory D123without the read caching operation, the module controller D121 may notprovide the VM write command and first address that is to be provided tothe volatile memory D121 for the read caching operation. Furthermore,the module controller D110 may not provide a tag TAG corresponding tothe data DT_n from the nonvolatile memory D123.

As described above, the nonvolatile memory module D100 may skip the readcaching operation based on a request of the processor 101.

FIG. 58 is a flowchart illustrating an operation of the nonvolatilememory module of FIG. 2. Referring to FIGS. 1, 2, and 58, in step ES110,the nonvolatile memory module 100 may receive a module swap command andaddress (SW/ADD) from the processor 101.

In example embodiments, the module swap command SW may be a command forwriting write data in the nonvolatile memory module 100. The module swapcommand SW may be a command for controlling a transaction of data storedin the volatile memory 121 and write data such that read and writeoperations about the volatile memory 121 of the nonvolatile memorymodule 100 is atomically performed. In example embodiments, the moduleswap command SW may be a command that is defined according to acommunication protocol between the processor 101 and the nonvolatilememory module 100.

In step ES120, after receiving the module swap command and address(SW/ADD), the nonvolatile memory module 100 may receive write data DT_wfrom the processor 101 through the memory data line MDQ.

In step ES130, the nonvolatile memory module 100 may output data, whichis stored in an entry corresponding to a part of an address ADD receivedafter the module swap command and address (SW/ADD) is received, from thevolatile memory 121 through the memory data line MDQ.

In step ES140, the nonvolatile memory module 100 may write the receivedwrite data DT_w in the volatile memory 121 or the nonvolatile memory123.

In example embodiments, operations of steps ES120 to ES140 may beperformed in parallel, and an order in which the operations areperformed may not be limited to an order.

In example embodiments, operations of steps ES120 to ES140 may beperformed atomically. That is, in the nonvolatile memory module 100, anoperation of receiving write data DT_w (step ES120), an operation ofoutputting data DT_v from the volatile memory 121 (ES130), and anoperation of writing the write data DT_w (ES140) may be one operationunit. That is, operations of steps ES120 and ES130 may compose an atomicoperation.

FIG. 59 is a block diagram for describing, in detail, the operationmethod illustrated in FIG. 58. Referring to FIGS. 1, 58, and 59, anonvolatile memory module E100 may include a module controller E110, avolatile memory E121, an NVM controller E122, a nonvolatile memory E123,and a data buffer E130. In example embodiments, the nonvolatile memorymodule E100 of FIG. 59 may be a device or module that is substantiallythe same as or similar to the nonvolatile memory module 100 of FIGS. 1and 2. For descriptive convenience, a description about theabove-described elements and elements (e.g., the SPD, the tag data line,etc.) unnecessary to describe an operation method of FIG. 56 areomitted.

For descriptive convenience, at least a part of a first address ADD1provided from the processor 101 is assumed as corresponding to a firstentry ET1 among a plurality of entries of the volatile memory E121. Thatis, the volatile memory E121 may select or activate the first entry ET1in response to the first address ADD1 from the module controller E110.

The module controller E110 may receive a module swap command and firstaddress (SW/ADD1) from the processor 101. The module controller E110 mayprovide an NVM write command and first address (WR_v/ADD1) to the NVMcontroller E122 and a VM swap command and first address (SW_v/ADD1) tothe volatile memory E121 in response to the received signal.

The volatile memory E121 may select or activate the first entry ET1corresponding to a part of the first address ADD1 in response to the VMswap command and first address (SW_v/ADD1). The first entry ET1 mayinclude data DT_v.

The first entry E1 may further include information about the data DT_vsuch as a tag TAG, a tag ECC, data ECC, and dirty information DRT, andthe tag TAG, tag ECC, data ECC, and dirty information DRT may beprovided to the module controller E110 and the NVM controller E122.

The processor 101 may send write data DT_w to the nonvolatile memorymodule E100 after a time elapses from a point in time when the moduleswap command and first address (SW/ADD1) is sent to the nonvolatilememory module E100. In example embodiments, the time may be a time(e.g., the write latency WL) that is determined according to theoperation characteristic of the nonvolatile memory module E100.

The volatile memory E121 of the nonvolatile memory module E100 mayreceive the write data DT_w through the data line DQ, the data bufferE130, and the memory data line MDQ ({circle around (1)}). Afterreceiving the write data DT_w, the volatile memory E121 may output dataDT_v stored in the first entry E1 through the memory data line MDQ({circle around (2)}). Afterwards, the volatile memory E121 may writethe received write data DT_w in the first entry ET1.

In example embodiments, the write data DT_w may be provided to the NVMcontroller E122 through the memory data line MDQ, and the NVM controllerE122 may program the received data DT_w in the nonvolatile memory E123.

In example embodiments, the NVM controller E122 may selectively programdata DT_v from the volatile memory E121 in the nonvolatile memory E123.For example, the NVM controller E122 may determine whether a cache hitor a cache miss occurs, based on the tag TAG of the data DT_v. Inexample embodiments, the NVM controller E122 may selectively programdata DT_v from the volatile memory E121 in the nonvolatile memory E123.

In example embodiments, the volatile memory E121 may store the writedata DT_w received through the memory data line MDQ in a separate buffercircuit and may output the data DT_v through the memory data line MDQbefore writing the received write data DT_w in the first entry ET1.Alternatively, the volatile memory E121 may read the data DT_v of thefirst entry ET1 using a separate data line while receiving the writedata DT_v through the memory data line MDQ, and after receiving thewrite data DT_w, the volatile memory E121 may output the data DT_v on aseparate data line through the memory data line MDQ.

That is, an operation of receiving the write data DT_v of the volatilememory E121, an operation of reading and outputting the data DT_v of thevolatile memory E121, and an operation of writing the write data DT_v ofthe volatile memory E121 may be performed as an atomic operation.

FIG. 60 is a timing diagram for describing, in detail, the operationmethod illustrated in FIG. 58. For descriptive convenience, a detaileddescription about the above-described elements is omitted, and elementsunnecessary to describe the operation method of FIG. 58 are alsoomitted.

Referring to FIGS. 1, 59, and 60, the module controller E110 may receivea module swap command and first address (SW/ADD1) from the processor101. The module controller E110 may provide an NVM write command andfirst address (WR_n/ADD1) to the NVM controller E122 and a VM swapcommand and first address (SW_v/ADD1) to the volatile memory E122 inresponse to the received signal.

The processor 101 may send first write data DT_w1 to the nonvolatilememory module E100 after a time elapses from a point in time when themodule swap command and first address (SW/ADD1) is sent to thenonvolatile memory module E100.

That is, the first write data DT_w1 may be provided to the volatilememory E121 and the NVM controller E122 through the memory data lineMDQ.

After receiving the first write data DT_w1, the volatile memory E121 mayoutput first data DT_v1 of a first entry ET1, which corresponds to atleast a part of the first address ADD1 through the memory data line MDQ.The first data DT_v may be provided to the NVM controller E122 throughthe memory data line MDQ.

In example embodiments, while the first data DT_v1 is output through thememory data line MDQ, the data buffer E130 may block a signal such thata signal of the memory data line MDQ does not affect the data line DQ.That is, the data buffer E130 may allow the first data DT_v1 not toaffect the data line DQ. That is, the processor 101 may not recognize atransaction about the first data DT_v1.

While the nonvolatile memory module E100 performs the transaction aboutthe first data DT_v1, the processor 101 may send a module swap commandand second address (SW/ADD2) to the nonvolatile memory module E100. Thatis, as in the above description, elements of the nonvolatile memorymodule E100 may receive second write data DT_w2 in response to themodule swap command and second address (SW/ADD2) and may perform thetransaction about the second data DT_v2.

As described above, the nonvolatile memory module E100 may perform aninternal operation atomically using the module swap command SW, therebyreducing a read latency about the nonvolatile memory module E100. Thismay mean that the performance of the nonvolatile memory module E100 isimproved.

FIGS. 61 and 62 are drawings for describing the operation of thevolatile memory of FIG. 59 in detail. For descriptive convenience,elements that are unnecessary to describe an operation of the volatilememory E 121 are omitted, and a detailed description about theabove-described elements is omitted.

Referring to FIGS. 59 and 61, the volatile memory E121 may include aninput/output (I/O) circuit E121 a. The input/output circuit E121 a maymanage data provided to the volatile memory E121 and data output fromthe volatile memory E121.

The input/output circuit E121 a may be connected with a plurality ofdata lines DL1 to DLi and DLi+1 to DLk and may send and receive datathrough the plurality of data lines DL1 to DLi and DLi+1 to DLk.

In example embodiments, the plurality of data lines DL1 to DLi and DLi+1to DLk may be classified into a first group G1 and a second group G2.The first group G1 may include the data lined data lines DL1 to DLi, andthe second group G2 may include the data lines DLi+1 to DLk.

In example embodiments, the data lines DL1 to DLi of the first group G1may constitute the memory data line MDQ. That is, the input/outputcircuit E121 a may be configured to receive write data DT_w through thedata lines DL1 to DLi of the first group G1.

In example embodiments, the input/output circuit E121 a may read dataDT_v stored in the first entry ET1 using the data lines DLi+1 to DLk ofthe second group G2. For example, the input/output circuit E121 a maydrive voltages of the data lines DLi+1 to DLk of the second group G2based on the data DT_v.

After receiving the write data DT_w through the data lines DLi+1 to DLk,the input/output circuit E121 a may output the data DT_v through thedata lines DL1 to DLi of the first group G1, by driving voltages of thedata lines DL1 to DLi of the first group G1 based on the voltages of thedata lines DLi+1 to DLk of the second group G2.

That is, as described above, the volatile memory E121 may read the dataDT_v using data lines, which are not used as the memory data line MDQ,among the plurality of data lines, thereby making it possible to performdata (DT_v) read and output operations atomically.

Referring to FIGS. 1, 59, and 62, the volatile memory E121′ may includea buffer circuit E121 b. The buffer circuit E121 b may be configured totemporarily store write data DT_w received through the memory data lineMDQ. In example embodiments, the buffer circuit E121 b may be composedof a part of a plurality of memory cells included in the volatile memoryE121′. Alternatively, the buffer circuit E121 b may be a separatestorage area. Alternatively, the buffer circuit E121 b may be a registercircuit.

For example, as described above, the volatile memory E121′ may receivethe write data DT_w through the memory data line MDQ and may temporarilystore the received write data DT_w in the buffer circuit 121 b ({circlearound (1)}). The volatile memory E121′ may output data DT_v stored inthe first entry E1 through the memory data line MDQ ({circle around(2)}). After the data DT_v is output through the memory data line MDQ,the volatile memory E121′ may write the write data DT_w stored in thebuffer circuit E121 b in the first entry ET1 ({circle around (3)}).

As described above, the volatile memory E121′ may further include aseparate buffer memory E121 b. The volatile memory E121′ may temporarilystore the write data DT_w in the buffer memory E121 b until the dataDT_v from the first entry ET1 is output through the memory data lineMDQ. Accordingly, the volatile memory E121′ may perform operations ofreceiving the write data DT_w and reading and outputting the data DT_vatomically.

FIG. 63 is a block diagram illustrating the nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept.Referring to FIGS. 1 and 63, a nonvolatile memory module E200 mayinclude a module controller E210, a volatile memory E221, an NVMcontroller E222, a nonvolatile memory E223, and a data buffer E230. Fordescriptive convenience, a detailed description about above-describedcomponents may be omitted.

The nonvolatile memory module E200 of FIG. 63 may further include aflush channel FC. For example, the volatile memory E221 and the NVMcontroller E222 may be configured to share the memory data line MDQ andthe tag data line TDQ. In addition, the volatile memory E221 and the NVMcontroller E222 may share the flush channel FC. The volatile memory E221and the NVM controller E222 may exchange data with each other throughthe flush channel FC.

In example embodiments, the flush channel FC may include a plurality ofdata lines and a data strobe signal line. In example embodiments, theflush channel FC may be blocked according to a request of the processor101.

FIG. 64 is a flowchart illustrating an operation of the nonvolatilememory module of FIG. 63. For descriptive convenience, a detaileddescription about above-described components may be omitted. Referringto FIGS. 1, 63, and 64, in step ES210, the nonvolatile memory moduleE100 may receive a module write command and address (WR/ADD) from theprocessor 101.

In step ES220, the nonvolatile memory module E200 may output data DT_vfrom the volatile memory E221 through the flush channel FC. For example,the module controller E210 may receive the module write command andaddress (WR/ADD) and may send a VM read command and address (RD_v/ADD)to the volatile memory E221. The volatile memory 121 may output the dataDT_v, which is stored in an entry corresponding to the address ADD, inresponse to the VM read command and address (RD_v/ADD). In exampleembodiments, the data DT_v output through the flush channel FC may beprovided to the NVM controller E222.

In example embodiments, the NVM controller E222 may selectively programthe data DT_v received through the flush channel FC in the nonvolatilememory E223. For example, the NVM controller E222 may receive a tag TAGabout data DT_w received through the flush channel FC in the volatilememory E221. The NVM module E222 may determine whether a cache hit or acache miss occurs, based on the tag TAG and the address ADD. The NVMcontroller E222 may selectively program the data DT_v received throughthe flush channel FC in the nonvolatile memory E223.

In step ES230, the nonvolatile memory module E200 may receive the dataDT_w through the memory data line MDQ (or the data line DQ). Forexample, the processor 101 may send write data DT_w to the nonvolatilememory module E200 after a time elapses from a point in time when themodule write command and address (WR/ADD) is sent to the nonvolatilememory module E100.

In example embodiments, an operation order of steps ES220 and ES230 maynot be limited to this disclosure. For example, operations of stepsES220 and ES230 may be performed in parallel.

In step ES240, the nonvolatile memory module E200 may write the receivedwrite data DT_w in the volatile memory 121 or the nonvolatile memory123. For example, the volatile memory E221 of the nonvolatile memorymodule E200 may receive the write data DT_w through the data line DQ andthe memory data line MDQ. The volatile memory E221 may store thereceived write data DT_w under control of the module controller E210.The NVM controller E222 may write the received write data DT_w in thenonvolatile memory E223 under control of the module controller E210.

FIG. 65 is a timing diagram for describing, in detail, the operationaccording to the flowchart of FIG. 64. Referring to FIGS. 1, 63, and 65,the module controller E210 may receive a module write command and firstaddress (WR/ADD1) from the processor 101.

The module controller E210 may provide an NVM write command and firstaddress (WR_n/ADD1) to the NVM controller E222 and a VM write commandand first address (WR_v/ADD1) to the volatile memory E221 in response tothe module write command and first address (WR/ADD1).

The volatile memory E221 may output first data DT_v1, which is stored inan entry corresponding to the first address ADD1 in response to the VMread command and first address (RD_v/ADD1).

In example embodiments, the processor 101 may send first write dataDT_w1 to the nonvolatile memory module E200 after a time elapses from apoint in time when the module write command and first address (WR/ADD1)is sent to the nonvolatile memory module E100. In this case, thevolatile memory E221 and the NVM controller E222 may receive the firstwrite data DT_w1 through the memory data line MDQ. The volatile memoryE221 may store the first write data DT_w1 in an area corresponding tothe first address ADD1 in response to the VM write command and firstaddress (WR_v/ADD1), and the NVM controller E222 may store the firstwrite data DT_w1 in an area corresponding to the first address ADD1 inresponse to the NVM write command and first address (WR_n/ADD1).

Likewise, the module controller E210 may receive a module write commandand second address (WR/ADD2) and may provide an NVM write command andsecond address (WR_n/ADD2) to the NVM controller E222 and a VM writecommand and second address (WR_v/ADD2) to the volatile memory E221 inresponse to the module write command and second address (WR/ADD2). Thevolatile memory E221 may output first data DT_v2, which is stored in anentry corresponding to the second address ADD2, in response to thereceived signals. Afterwards, each of the volatile memory E221 and theNVM controller E222 may receive second write data DT_w2 through thememory data line MDQ. The volatile memory E221 and the NVM controllerE222 may write the second write data DT_w2 in areas correspondingthereto, respectively.

In example embodiments, the output of the first and second data DT_v1and DT_v2 of the volatile memory E221 and the receiving of the first andsecond write data DT_w1 and DT_w2 may be performed through differentdata buses. For example, the volatile memory E221 may output the firstand second data DT_v1 and DT_v2 and may receive the first and secondwrite data DT_w1 and DT_w2 through the memory data line MDQ. Becauseoutputting and receiving data using different data buses, the volatilememory E221 may perform an operation of outputting the first and seconddata DT_v1 and DT_v2 and an operation of receiving the first and secondwrite data DT_w1 and DT_w2 in a parallel or overlap manner. Accordingly,a read latency may be reduced.

FIG. 66 is a block diagram for describing, in detail, the operationaccording to the timing diagram of FIG. 65. Referring to FIGS. 1, 65,and 66, the nonvolatile memory module E200 may include the modulecontroller E210, the volatile memory E221, the NVM controller E222, thenonvolatile memory E223, and the data buffer E230. For descriptiveconvenience, a detailed description about elements, which areunnecessary to describe an operation according to the timing diagram ofFIG. 65, and the above-described elements is omitted.

The module controller E210 may receive a module write command and firstaddress (WR/ADD1) from the processor 101 and may provide an NVM writecommand and first address (WR_n/ADD1) to the NVM controller E222 and aVM read command and first address (RD_v/ADD1) and a VM write command andfirst address (WR_v/ADD1) to the volatile memory E221 in response to themodule write command and first address (WR/ADD1).

On the basis of the VM read command and first address (RD_v/ADD1), thevolatile memory E221 may send data DT_v, which is stored in a firstentry ET1 corresponding to the first address ADD1 to the NVM controllerE222 through the flush channel FC.

As described above, the processor 101 may send write data DT_w to thenonvolatile memory module E200 after a time elapses from a point in timewhen the module write command and first address (WR/ADD1) is sent to thenonvolatile memory module E200. That is, the volatile memory E221 mayreceive the write data DT_w through the memory data line MDQ and maywrite the write data DT_w in the first entry ET1 corresponding to thefirst address ADD1 in response to the VM write command and first address(WR_v/ADD1).

In example embodiments, because an operation of outputting data and anoperation of receiving data are performed through different data buses(e.g., the flush channel FC and the memory data line MDQ) in thevolatile memory E221, the operations may be performed in a parallel oroverlap manner.

FIG. 67 is a timing diagram for describing, in detail, the operationaccording to the flowchart of FIG. 64, according to example embodimentsof the inventive concept. Referring to FIGS. 1, 63, and 67, thenonvolatile memory module E200 may receive a module flush command andfirst address (WRF/ADD1) from the processor 101. In example embodiments,the module flush command SWF may be a command for writing write data inthe nonvolatile memory module E300. The module flush command WRF may bea command for sending data DT_v from the volatile memory E221 of thenonvolatile memory module E200 to the NVM controller E222 through theflush channel FC. The module flush command WRF may be a command that ispreviously defined according to a communication protocol between thenonvolatile memory module E200 and the processor 101.

The module controller E210 may provide an NVM write command and firstaddress (WR_n/ADD1) to the NVM controller E222 and a VM flush commandand first address (WRF/ADD1) to the volatile memory E221 in response tothe module flush command and first address (WRF/ADD1).

In example embodiments, the processor 101 may send first write dataDT_w1 to the nonvolatile memory module E200 after a time elapses from apoint in time when the module flush command and first address (WRF/ADD1)is sent to the nonvolatile memory module E200.

On the basis of the VM flush command and first address (WRF/ADD1), thevolatile memory E221 may receive the first write data DT_w1 through thememory data line MDQ and may output first data DT_v1 through the flushchannel FC. In this case, the first data DT_v1 may be data that isstored in an entry corresponding to the first address ADD1. The volatilememory E221 may store the received first write data DT_w1 in an entrythat corresponds to the first address ADD.

Likewise, the module controller E210 may receive a module flush commandand second address (WRF/ADD2) from the processor 101 and may provide anNVM write command and second address (WR_n/ADD2) to the NVM controllerE222 and a VM flush command and second address (WRF/ADD2) to thevolatile memory E221 in response to the received signals.

On the basis of the VM flush command and second address (WRF/ADD2), thevolatile memory E321 may receive second write data DT_w2 through thememory data line MDQ and may output second data DT_v2 through the flushchannel FC. In this case, the second data DT_v2 may be data that isstored in an entry corresponding to the second address ADD2. Thevolatile memory E221 may store the received second write data DT_w2 inan entry that corresponds to the second address ADD2.

In example embodiments, as illustrated in FIG. 67, the volatile memoryE221 may perform an operation of receiving the first and second writedata DT_w1 and DT_w2 and an operation of outputting the first and seconddata DT_v1 and DT_v2 in parallel. That is, the volatile memory E221 mayperform data input and output operations in parallel so that the writelatency may be reduced.

FIG. 68 is a block diagram illustrating the nonvolatile memory module ofFIG. 2, according to example embodiments of the inventive concept. Forease of illustration, elements (e.g., a module controller and an SPD)other than a heterogeneous memory device E120 and a data buffers E130are omitted. For descriptive convenience, a detailed description aboutabove-described components may be omitted. Referring to FIGS. 1, 2, and68, a nonvolatile memory module E300 may include a volatile memory E321,an NVM controller E322, a nonvolatile memory E323, and a data bufferE330.

The volatile memory E321 may include a plurality of volatile memorychips VM1 to VMn. The nonvolatile memory E323 may include a plurality ofnonvolatile memory chips NVM. Each of the plurality of volatile memorychips VM1 to VMn, the plurality of nonvolatile memory chips NVM, and theNVM controller E322 may be implemented with a separate chip or aseparate package. Alternatively, the plurality of volatile memory chipsVM1 to VMn, the plurality of nonvolatile memory chips NVM, and the NVMcontroller E322 may be implemented with a package through a multi-chippackage way.

The plurality of volatile memory chips VM1 to VMn may be configured toshare different memory data lines MDQ1 to MDQn with the NVM controllerE322. For example, the first volatile memory VM1 may share the firstmemory data line MDQ1 with the NVM controller E322. The first memorydata line MDQ1 may be connected with the data buffer E330. In exampleembodiments, the first memory data line MDQ1 may include eight lines.The n-th volatile memory VMn may share the n-th memory data line MDQnwith the NVM controller E322. The n-th memory data line MDQn may beconnected with the data buffer B330. In example embodiments, the n-thmemory data line MDQn may include eight lines. That is, each of theplurality of volatile memories VM1 may share a corresponding one amongthe memory data lines MDQ1 to MDQn with the NVM controller E322, and theplurality of memory data lines MDQ1 to MDQn may be connected with onedata buffer E330.

The data buffer E330 may be connected with the processor 101 (refer toFIG. 1) through the data line DQ. In this case, the number of data linesDQ may be determined according to the number of memory data lines MDQ1to MDQn.

The plurality of volatile memory chips VM1 to VMn may be connected withthe NVM controller E322 through a plurality of flush channels FC1 toFCn, respectively. That is, as described above, the plurality ofvolatile memory chips VM1 to VMn may send data to the NVM controllerE322 through the plurality of flush channels FC1 to FCn, respectively.In example embodiments, each of the plurality of flush channels FC1 toFCn may include a plurality of data lines as a data transmission pathand a plurality of data strobe signal lines for capturing signals of theplurality of data lines.

FIG. 69 is a block diagram for describing a method of implementing afirst flush channel of the first volatile memory chip illustrated inFIG. 68. For descriptive convenience, elements that are unnecessary todescribe the first flush channel FC1 are omitted.

Referring to FIGS. 68 and 69, the first volatile memory chip VM1 may beconnected with a plurality of data lines DL1 to DLi and DLi+1 to DLk.The first volatile memory chip VM1 may exchange data with an externaldevice through the plurality of data lines DL1 to DLi and DLi+1 to DLk.

In example embodiments, a part (e.g., DL1 to DLi) of the plurality ofdata lines DL1 to DLi and DLi+1 to DLk connected with the first volatilememory chip VM1 may be used as the memory data line MDQ. That is, thefirst volatile memory chip VM1 may be connected with the data bufferE330 and the NVM controller E322 through the data line DL1 to DLi.

The others (e.g., DLi+1 to DLk) of the plurality of data lines DL1 toDLi and DLi+1 to DLk connected with the first volatile memory chip VM1may be used as the first flush channel FC1. That is, the first volatilememory chip VM1 may be connected with the NVM controller E322 throughthe data lines DLi+1 to DLk and may send data stored therein to the NVMcontroller E322 under control of an external device (e.g., the modulecontroller).

As described above, the volatile memory E321 may use a part of aplurality of lines as the memory data line MDQ and the others thereof asthe flush channel FC.

FIG. 70 is a block diagram illustrating another user system to which thenonvolatile memory module according to example embodiments of theinventive concept is applied. Referring to FIG. 70, a computing systemE4000 may include a processor E4001 and a plurality of memories E4110 toE4140. The processor E4001 may include a memory controller 4002. Theprocessor E4001, the plurality of memories E4110 to E4140, and thememory controller 4002 are substantially the same as those of FIG. 26,and a detailed description thereof is thus omitted.

In example embodiments, the plurality of memories E4110 to E4140 of FIG.70 may be interconnected through a separate channel E4004 (e.g., a flushdedicated channel). The plurality of memories E4110 to E4140 mayexchange data with each other through the separate channel E4004. Inexample embodiments, as described with reference to FIGS. 1 to 26, theplurality of memories E4110 to E4140 may exchange data with each otherthrough the separate channel E4004 (i.e., the flush dedicated channel)and may selectively store data received through the separate channelE4004.

In example embodiments, the separate channel E4004 may be a side bandinterface. For example, the separate channel E4004 may be a channel thatis not connected with the processor E4001 or the memory controller 4002and connects the plurality of memories E4110 to E4140.

In example embodiments, the separate channel E4004 may be provided basedon the same interface (e.g., a DDR interface) of that of a bus E4003between the plurality of memories E4110 to E4140 and the memorycontroller 4002. Alternatively, the separate channel E4004 may beprovided based on an interface different from that of the bus E4003. Forexample, the separate channel E4004 may be provided based on a serialbus such as I2C, SMBus, PMBus, IPMI, or MCTP. The separate channel E4004may be provided based on at least one among double data rate (DDR),DDR2, DDR3, DDR4, low power DDR (LPDDR), universal serial bus (USB),multimedia card (MMC), embedded MMC, peripheral componentinterconnection (PCI), PCI-express (PCI-E), advanced technologyattachment (ATA), serial-ATA, parallel-ATA, small computer smallinterface (SCSI), enhanced small disk interface (ESDI), integrated driveelectronics (IDE), firewire, universal flash storage (UFS), ornonvolatile memory express (NVMe).

In example embodiments, each of the plurality of memories E4110 to E4140may include separate signal pins or signal lines for connection with theseparate channel E4004.

As is traditional in the field of the inventive concepts, exampleembodiments are described, and illustrated in the drawings, in terms offunctional blocks, units and/or modules. Those skilled in the art willappreciate that these blocks, units and/or modules are physicallyimplemented by electronic (or optical) circuits such as logic circuits,discrete components, microprocessors, hard-wired circuits, memoryelements, wiring connections, and the like, which may be formed usingsemiconductor-based fabrication techniques or other manufacturingtechnologies. In the case of the blocks, units and/or modules beingimplemented by microprocessors or similar, they may be programmed usingsoftware (e.g., microcode) to perform various functions discussed hereinand may optionally be driven by firmware and/or software. Alternatively,each block, unit and/or module may be implemented by dedicated hardware,or as a combination of dedicated hardware to perform some functions anda processor (e.g., one or more programmed microprocessors and associatedcircuitry) to perform other functions. Also, each block, unit and/ormodule of the example embodiments may be physically separated into twoor more interacting and discrete blocks, units and/or modules withoutdeparting from the scope of the inventive concepts. Further, the blocks,units and/or modules of the example embodiments may be physicallycombined into more complex blocks, units and/or modules withoutdeparting from the scope of the inventive concepts.

While the inventive concept has been described with reference to exampleembodiments, it will be apparent to those skilled in the art thatvarious changes and modifications may be made without departing from thespirit and scope of the inventive concept. Therefore, it should beunderstood that the above example embodiments are not limiting, butillustrative.

1. A nonvolatile memory device comprising: a nonvolatile memory; avolatile memory being a cache memory of the nonvolatile memory; a firstcontroller configured to control the nonvolatile memory; and a secondcontroller configured to: receive a device write command and an address;and transmit, to the volatile memory through a first bus, a first readcommand and the address and a first write command and the addresssequentially, and transmit a second write command and the address to thefirst controller through a second bus, in response to the reception ofthe device write command and the address.
 2. The nonvolatile memorydevice of claim 1, wherein the volatile memory is configured to, inresponse to the transmission of the first read command and the address,transmit, through a memory data line, first data that is stored in anarea corresponding to a part of the address, of the volatile memory, andtransmit, through a tag data line, a tag that is stored in the area. 3.The nonvolatile memory device of claim 2, wherein the first controlleris further configured to: receive the transmitted first data from thevolatile memory through the memory data line; receive the transmittedtag from the volatile memory through the tag data line; and selectivelystore the received first data in the nonvolatile memory based on theaddress and the received tag.
 4. The nonvolatile memory device of claim3, wherein the first controller is further configured to, in response tothe received tag being different from a part of the address, store thereceived first data in the nonvolatile memory.
 5. The nonvolatile memorydevice of claim 1, wherein each of the volatile memory and the firstcontroller is further configured to receive write data from an externaldevice, wherein the volatile memory is configured to store the writedata in an area corresponding to the address, of the volatile memory, inresponse to the transmission of the first write command and the address,and wherein the first controller is further configured to store thewrite data in an area corresponding to the address, of the nonvolatilememory, in response to the transmission of the second write command andthe address.
 6. The nonvolatile memory device of claim 5, wherein thesecond controller is further configured to transmit, to the volatilememory, a write tag corresponding to the write data, and wherein thevolatile memory is further configured to store both the write data andthe write tag in an area corresponding to a part of the address, of thevolatile memory.
 7. The nonvolatile memory device of claim 5, whereinthe write data is received from the external device through a memorydata line after a time period elapses from a point in time when thedevice write command and the address are received from the externaldevice.
 8. The nonvolatile memory device of claim 7, further comprisinga serial presence detect chip configured to transmit, to the externaldevice, information of the time period.
 9. The nonvolatile memory deviceof claim 1, further comprising a data buffer connected to an externaldevice and configured to: share a memory data line with the volatilememory and the first controller; and operate based on a control of thesecond controller.
 10. The nonvolatile memory device of claim 1, whereinthe volatile memory is a direct mapping cache memory of the nonvolatilememory.
 11. A nonvolatile memory device comprising: a nonvolatilememory; a volatile memory being a cache memory of the nonvolatilememory; a first controller configured to control the nonvolatile memory;and a second controller configured to: receive a first device readcommand and an address; and transmit a first read command and theaddress to the volatile memory through a first bus, and transmit asecond read command and the address to the first controller through asecond bus, in response to the reception of the device read command andthe address.
 12. The nonvolatile memory device of claim 11, wherein thevolatile memory is configured to, in response to the transmission of thefirst read command and the address, transmit, through a memory dataline, first data that is stored in a first area corresponding to a partof the address, of the volatile memory, and transmit, through a tag dataline, a first tag that is stored in the first area.
 13. The nonvolatilememory device of claim 12, wherein the first data is transmitted to anexternal device after a time period elapses from a point in time whenthe first device read command and the address are received from theexternal device, and wherein the nonvolatile memory device furthercomprises a serial presence detect chip configured to transmit, to theexternal device, information of the time period.
 14. The nonvolatilememory device of claim 12, wherein the second controller is furtherconfigured to: receive the transmitted first tag from the volatilememory through the tag data line; determine whether a cache hit occurs,based on the received first tag and the address; and transmit, to theexternal device, a result of the determination.
 15. The nonvolatilememory device of claim 14, wherein the first controller is furtherconfigured to, in response to the determination that the cache hit doesnot occur, read second data from a second area corresponding to theaddress, of the nonvolatile memory.
 16. The nonvolatile memory device ofclaim 15, wherein the second controller is further configured to:receive, from the external device, a second device read command and theaddress; and transmit a first write command and the address to thevolatile memory through the first bus, and transmit a third read commandand the address to the first controller through the second bus, inresponse to the reception of the second device read command and theaddress.
 17. The nonvolatile memory device of claim 16, wherein thefirst controller is further configured to transmit the read second datathrough the memory data line in response to the transmission of thethird read command and the address.
 18. The nonvolatile memory device ofclaim 17, wherein the volatile memory is further configured to receivethe transmitted second data from the first controller through the memorydata line, and store the received second data in the first area of thevolatile memory, in response to the transmission of the first writecommand and the address.
 19. The nonvolatile memory device of claim 17,wherein the first controller is further configured to transmit, throughthe tag data line, a second tag comprising a part of the address insynchronization with a point in time when the second data is transmittedthrough the memory data line.
 20. (canceled)
 21. A nonvolatile memorydevice comprising: a nonvolatile memory; a volatile memory being a cachememory of the nonvolatile memory; a first controller configured to sharea memory data line with the volatile memory, and control the nonvolatilememory; and a second controller configured to: share a tag data linewith the volatile memory and the first controller; receive a firstdevice read command and an address from an external device; and transmita first read command and the address to the volatile memory through afirst bus, and transmit a second read command and the address to thefirst controller through a second bus, in response to the reception ofthe device read command and the address, wherein the volatile memory isconfigured to, in response to the transmission of the first read commandand the address, transmit, through the memory data line, first data thatis stored in a first area corresponding to a part of the address, of thevolatile memory, and transmit, through the tag data line, a tag that isstored in the first area, and wherein the second controller is furtherconfigured to: receive the transmitted tag from the volatile memorythrough the tag data line; determine whether a cache hit occurs, basedon the received tag and the address; and transmit, to the externaldevice, a result of the determination. 22.-40. (canceled)